List of 2000+ abbreviations
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Abbreviation | Meaning |
---|---|
0 | Angular measure; degree |
0C | Degree Celsius/centigrade |
0F | Degree Fahrenheit |
2DI | Two Dimensional Inspection (on Screen printing machines) |
3D | Three-dimensional |
3DPM | 3 Dimensional Packaging Module |
5 S | Seiri (Organization or sort), Seiton (Orderliness or arrange), Seisou (Cleanliness), Seiketsu (Standardized cleanup), Shitsuke (Discipline) |
A | Ampere |
A / D | After date |
A / I | Automatic insertion |
A / P | Accounts payable |
A / R | Accounts receivable or All risks |
A / S | After sight |
AAGR | Average annual growth rate |
AAR | Against all risks |
ABC | Activity-based costing |
ABP | Active Business Partners |
ABS | Acrylonitrile-butadiene-styrene (plastic) or antiblocking system |
ac | Alternating current |
AC | Alternating current |
ACAR | Audit corrective action request |
ACI | Axial circuit insertion |
ACM | Advanced component mounter (Philips machine) |
ACP | African, Caribbean and Pacific Countries |
ACWP | Actual Cost of Work Performed (EVA term) |
AD | After date |
ADB | Asian Development Bank |
ADL | Allowable dirt level |
ADM | Activity Diagram Method |
ADP | Avis de depannage provisoire |
AEC | African Economic Community |
AEC | Architecture, engineering, and construction |
AfDB | African Development Bank |
AFNOR | Association Francaise de Normalization |
AGV | Automatic guided vehicle |
AI | Artificial intelligence |
AIAG | Automotive Industry Action Group |
AICPA | American Institute of Certified Public Accountants |
AIMS | Automated inspection & Measurement systems |
AIPM | Australian Institute of Project Management |
AIS | Adhesive interconnect system |
AL | Arab League |
ALADI | Latin American Integration Association |
ALAP | As Late As Possible (flexible constraint in Microsoft Project) |
ALE | Assembly line equipment |
AM | Automatic module (FCM Philips machines) |
AMF | American Manufacturing Facility (N. Amer. Factory/Region) |
AML | Approved manufacturing list |
AMU | Arab Maghreb Union |
ANOVA | Analysis of variance |
ANSI | American National Standards Institute |
ANZUS | Australia-New Zealand-United States Security Treaty |
AOA | Activity on Arrow |
AOI | Automatic optical inspection |
AOL | America on line |
AON | Activity on Node |
AOP | Annual operational plan |
AOQ | Average outgoing quality |
APCC | Asia Pacific Customer Center (Penang) |
APEC | Asia-Pacific Economic Co-operation |
APICS | American production and inventory control system |
APR | Asian Pacific Region |
APS | Advanced Planning System |
APT | Automatically programmed tools |
AQC | Acceptance quality control |
AQL | Acceptable quality level |
AQS | Assembly quality system |
AR | Action require or All risks |
ARPA | Advanced Research Projects Agency |
AS | After sight |
ASAP | As soon as possible |
ASCII | American Standard Code for Information Interchange |
ASEAN | Association of South-East Asian Nations |
ASIC | Application specific integrated circuit |
ASL | Approved supplier list |
ASM | American Society for Metals |
ASME | American Society of Mechanical Engineers |
ASP | Automatic stencil printer or Association of Shareware Professionals |
ASQC | American Society for Quality Control |
ASTM | American Society for Testing Materials |
AT | Advanced technology |
at. % | Atomic percent |
ATE | Automatic test equipment |
ATG | Automatic test generation |
atm | Atmospheres |
ATP | Advanced technology program or Available to promise |
ATS | Automatic test system |
AUDI | Accelerates Under Demonic Influence |
AUDI | Always Unsafe Designs Implemented |
AVL | Approved vendor listing |
AVL | Approved vendor list |
AWB | Air way bill |
AWG | American Wire Gauge |
AXI | Automatic X-ray inspection |
BABT | British approval board for telecommunications |
BAC | Budget at Completion |
BATS | Basic assurance tests |
BBRAM | Battery backup random access memory |
BC | Business center |
BCC | Blind carbon copy |
BCD | Best Can Do |
BCP | Business continuity plan |
BCP | B.o.M. Change Proposal |
BCWP | Budgeted Cost of Work Performed (EVA term) |
BCWS | Budgeted Cost of Work Scheduled (EVA term) |
BD | Breakdown |
BDX | Bordeaux (France) |
BEC | Basic electronic components |
Benelux | Benelux Economic Union |
BER | Bit error rate |
BGA | Ball grid array |
BI | Barcode identification (FCM Philips machines) |
BIA | Business impact analysis |
BID | Business Initiative Directions |
BIOS | Basic input output system |
BIS | Bank for International Settlements |
BIST | Built in self-test |
BIT | Binary digit (value = 1 or 0, on or off) |
BIT | Built in test |
BL | Back load |
BLEU | Belgo-Luxembourg Economic Union |
BM | Bad mark |
BMS | Bad mark sensing (FCM Philips machines) |
BMV | Board vision module (FCM Philips machines) |
BMW | Beautiful Mechanical Wonder |
BMW | Big Money Works |
BMW | Bought My Wife |
BMW | Brutal Money Waster |
BO | Business Objects |
BOD | Biochemical oxygen demand |
BOM | Bill of material |
BPO | Business process owner |
BPP | Basic productive process – reduction on tariff for parts and assemblies |
BPS | Best practice sharing |
BQFP | Bumper quad flat pack |
BRA | Basic Rate Acces |
BS | Boundary scan |
BSB | Backstreet boys |
BSI | British standards institute (ISO 9000 Certifier) |
BTAB | Bumped tape-automated bonding |
BTO | Build to order |
BTTE | Built-in test equipment |
BTU | British thermal unit |
BTW | By The Way |
BUICK | Big Ugly Indestructable Car Killer |
Burn-in | Thermal chamber that heats and cools boards to detect latent failures |
Byte | String of 8 bits (generally defines a keyboard character) |
C & F | Cost and freight |
C & I | Cost, insurance |
C & I | Commission and interest |
C / A | Corrective action |
C / C | Communication center |
C / D | Cash against documents |
C4 | Controlled collapse chip connect |
CACM | Central American Common Market |
CAD | Computer-aided (assisted) design or Cash against documents |
CADDIE | Program that receives and catalogues customer CAD data |
CAE | Computer-assisted engineering or Certificate in Advanced English |
CAFM | Computer-aided facilities management |
CAGE | Commercial and government entity |
CAGR | Compounded annual growth rate |
CALS | Computer-aided acquisition and logistic support |
CAM | Computer-aided (assisted) Manufacturing |
CAN | Controller area network (on DeK machine) |
CAO | Chief Administrative Officer |
CAPP | Computer-aided process planning |
Caps Lock | Capital letters lock |
CAR | Corrective action request or Capital approval request or Corrective action report |
CARICOM | Caribbean Community and Common Market |
CASE | Computer-aided software engineering |
CAT | Computer-aided testing |
CBA | Circuit board assembly |
CBC&E | Code of Business Conduct & Ethics |
CBD | Cash before delivery |
CBGA | Ceramic ball grid array |
CBP | CIM Bridge project (FCM Philips machine) |
CC | Carbon copy |
CCA | Circuit card assembly |
CCAPS | Circuit card assembly and processing system |
CCB | Change Control Board |
CCC | Command call center or China Customer Center (Dell China Factory/Region) |
CCD | Charge coupled device |
CCE | Customer contact employee |
CCG | Customer Configuration Groups (Common management of part numbers) |
CCGA | Ceramic column grid array |
CCIMF | Communication centre intermediate file – text file (on Fuji machines) |
CCNA | Cisco Certified Network Associate |
CCNM | Customer commodity and N.P.I. Management |
CCRP | Customer complaint resolution process |
CD | Can Do |
CDA | Confidential disclosure agreement |
CDQ | Customer Quality Data |
CDRH | Centre for Devices and Radiological Health |
CD-ROM | Compact disk – read-only memory |
CDT | Corporate deployment team |
CEAO | West African Economic Community |
CEEAC | Economic Community of Central African States |
CEFTA | Central European Free Trade Agreement (originally Visegrad Three) |
CEO | Chief executive officer |
CEPGL | Economic Community of the Great Lakes Countries |
CFC | Chloro Fluoro Carbons |
cfh | Cubic feet per hour |
cfm | Cubic feet per minute |
CFM | Continuous flow manufacturing |
CFT | Customer focus team or Centre for Manufacturing Technology |
CFT | Cross-Functional Team |
CGA | Column grid array |
CH. PPD. | Charges prepaid |
CHEVROLET | Can Hear Every Valve Rap On Long Extended Trips |
CHEVROLET | Cheap, Hardly Efficient, Virtually Runs On Luck Every Time |
CHIP | Ceramic capacitors or resistors |
CI | Cost, insurance |
CIA | Cash in advance |
CIC | Condensation inert curing |
CIF | Cost, insurance, freight |
CIH | Condensation inert heating |
CILSS | Permanent Inter-State Committee on Drought Control in the Sahei |
CIM | Computer integrated manufacturing |
CIS | Condensation inert soldering |
CIS | Commonwealth of Independent States |
CKDB | Component knowledge database |
CLC | Closed loop calibration (FCM Philips machines) |
CLCA | Closed loop corrective action |
CLCC | Ceramic leaded chi carrier |
CLCP | Closed loop corrective action |
CLIP | Confirmed line item performance |
CLM | Compact laser modules (FCM Philips machines) |
CLS | Celestica (Solectron’s competitor) |
CM | Contract manufacturers |
CMA | Circuit mil area |
CMC | Capacity management committee |
CMD | Circuit mode data |
CMO | Chief Materials Officer |
CMOS | Complimentary metal oxide semiconductor |
CNC | Computer numerical control |
CND | Conform non-defect |
CO | Change order |
COA | Cost of acquisition |
COB | Card on board or Chip on board |
COC | Certificate of Compliance |
COCOM | Co-ordinating Committee for Multilateral Export Controls |
COD | Consumed oxygen demand or Cash on delivery |
COE | Center of excellence |
COF | Chip on flex |
COG | Center of gravity (S.I.M.S.) |
COGS | Cost of goods sold |
COM | Computer output to microfilm |
CON | Configuration file (on FCM Philips machines) |
COO | Country of origin |
COO | Chief Operating Officer |
COS | Cash on shipment |
CP | Process capability index or Chip placement |
CPA | Critical Path Analysis |
CPBGA | Cavity plastic ball grid array |
CPC | Customer Project Code |
CPCN | Cost procurement |
CPE | Certificate of Proficiency in English |
CPFF | Cost Plus Fixed Fee |
CPI | Continuous process improvement |
CPI | Cost Performance Index (EVA term) |
CPIF | Cost Plus Incentive Fee |
CpK | Adjusted process capability index (Capability performance) |
CPL | Capability performance – lower |
CPM | Customer program manager |
CPM | Critical Path Method |
CPN | Customer part number |
CPU | Central processing unit |
CQFP | Ceramic quad flat pack |
CQM | Center of Quality Management |
CR | Carriage Return |
CRF | Component request form |
CRM | Customer Relationship Management |
CRR | Customer reject return |
CRT | Cathode ray tube |
CS | Customer service |
CS | Control site |
CSA | Customer satisfaction assessment or Canada standards Assn. |
CSCE | Conference on Security and Co-operation in Europe |
CSCM | Customer supply chain management |
CSD | Committed ship date |
CSE | Customer support engineer |
CSI | Customer satisfaction index |
CSM | Customer satisfaction management |
CSP | Chip scale package |
CSS | Canadian safety standard |
CTB | Clear to build |
CTE | Coefficient of thermal expansion |
CTEC | Certified Technical Education Center |
CTF | Critical to function |
CTO | Configure to order |
CTP | Composite theoretical performance (used for export compliance) |
CTR | Cycle time reduction |
CV | Cost Variance (EVA term) |
CVR | Colour Variance Request |
CVT | Component verification and tracking |
CWK | Chan Wah KONG |
CWO | Cash with order |
D | Diameter |
D / A | Documents against acceptance, documents attached |
D / D | Draft on demand |
D / P | Documents against payment |
DAC | Digital to analog converter |
DARM | Defect analysis & reduction methods |
DAT | Digital audio tape |
dB | Decibel |
DBC | Direct bonded copper |
DBR | Daily business review |
DC | Document control or DFA / BMS controller (FCM Philips machines) |
DCA | Direct chip attach or Daily corrective action |
DCE | Dicloroethylene |
DCF | Discounted Cash Flow |
DCP | Dynamic Control Plan (Dimensional Control Plan) |
DCT | Digital cordless telephone |
DD | Data Date |
DDE | Dynamic data exchange |
DDU | Delivery duty unpaid |
DECT | Digital enhanced cordless telephone |
DEF | DEMANDE D’ESSAI EN FABRICATION (PHILIPS) |
DEK | DirEKt imaging |
DEM | Dynamic enterprise modeler |
DFA | Dynamic fiducial alignment (FCM Philips machines) |
DFM | Design for manufacturability |
DFMA | Design for manufacturability and assembly |
DFMEA | Design Failure Mode and Effects Analysis |
DFT | Design for testability |
DFX | Design for whatever |
DHL | (Adrian) Dalsey, (Larry) Hillblom, and (Robert) Lynn (courier company) or Deliver Halfway Lost |
diam | Diameter |
DIL | Dual inline |
DIN | Deutsches Institut fur Normung (Worldwide level 2 connector) |
DIP | Dual inline package |
DISCRETE | A passive analog component, i.e. capacitor, resistor, inductor or diode |
DLL | Dynamic link library |
DMA | Direct memory access |
DMD | Data management and documentation (Solectron Germany) |
DMR | Defective material reject |
DNC | Direct numerical control |
DOC | Department for communications |
DOD | Department of Defense |
DODGE | Drips Oil, Drops Grease Everywhere |
DOE | Design of experiments |
DOR | Dropped on request |
DOS | Days of supply or Disk operating system |
DPM | Defects per million |
DPMO | Defects per million opportunities |
DPPM | Defective parts per million |
DPU | Defects per unit |
DRAM | Dynamic random access memory |
DRC | Design rule checking |
DRRP | Disaster response and recovery plan |
DSC | Debt Service Coverage |
DSI | Days of saleable inventory |
DSM | Dynamic setup management |
DSO | Days sales outstanding |
DSP | Digital signal processor |
DSR | Digital storage and retrieval |
DT | Demand de travaille (Wavecom) |
DT | Deutsche Telecom |
DTM | Digital torque meter |
DTS | Dock to stock |
DU | Duration |
DUT | Device under test |
DVD | Digital video disk or digital versatile disk |
DVM | Digital voltmeter |
DVP&R | Design Verification Plan and Report |
DVR | Destination Variance Request |
DVT | Design verification test |
E & OE | Errors and omissions excepted |
E and O | Excess and Obsolete |
EAC | Estimate at Completion |
EAN | European article numbering |
EBOM | Engineering bill of material |
EBRD | European Bank for Reconstruction and Development |
EC | Engineering change |
ECA | Economic Commission for Africa |
ECAD | Electronic computer-aided design |
ECAR | External corrective action request |
ECAT | Electronic card assembly and test (acronym used by and for I.B.M. P.C.B.) |
ECC | Engineering Change Control or Employee Communication Committee |
ECCB | Electronic Component Certification Board |
ECCN | Export compliance control number |
ECE | Economic Commission for Europe |
ECF | Engineering Change File |
ECL | Emitter coupled logic |
ECLAC | Economic Commission for Latin America and the Caribbean |
ECN | Engineering change notice |
ECO | Engineering change order |
ECOWAS | Economic Community of West African States |
ECR | Engineering change request |
ECU | Environmental control unit (M.P.M.) |
EDA | Electronic design automation |
EDC | Engineering date code |
EDC | Eau de cologne |
EDF | Electronic design interchange format |
EDFI | Error detection and fault isolation capability of product |
EDI | Electronic data exchange for placing P.O.s and forecasting |
EDM | Engineering data management |
EDP | Eau de perfume |
EDT | Eau de toilette |
EEA | European Economic Area |
EEPROM | Electronically erasable programmable read-only memory |
EET | Earliest Event Time |
EFD | Earliest Finish Date |
EFR | External Failure Rate |
EFT | Earliest Finish Time |
EFTA | European Free Trade Association |
EH&S | Environmental health and safety |
EIA | Electronic industries association |
EIAJ | Electronics Industry Association in Japan |
EIB | European Investment Bank |
EIS | Engineering information system |
ELA | Entry Level Automatic |
ELO | Enabling learning objective (on FCM Philips machines) |
EMC | Electromagnetic compatibility |
EMF | Electromotive force or European Manufacturing Facility (for DELL (Limeric, Ireland)) |
EMI | Electromagnetic interference |
EMO | Emergency Off |
EMP | Electromagnetic pulse |
EMPF | Electronics Manufacturing Productivity Facility |
EMPI | Electronic manufacturing process instruction |
EMS | Environmental Management System |
EMT | Electronic manufacturing technology |
EOD | End of data |
EOE | End of effective, work center implementation commit date |
EOF | End of file |
EOL | End of life |
EOS | Employee opinion survey |
EP&J | Electronic packaging & joining |
EPA | Environmental protection agency |
EPB | Emergency Push Button |
EPD | Electrical proximity detector (FCM Philips machines) |
EPK | Econopak |
EPP | Employee preparedness program |
EPROM | Erasable programmable read only memory |
EPST | Earliest Possible Start Time |
ERP | Enterprise requirements plan |
ERS | Engineering requirements specification |
ESA | European Space Agency |
ESCAP | Economic and Social Commission for Asia and the Pacific |
ESCWA | Economic and Social Commission for Western Asia |
ESD | Electrostatic discharge |
ESD | Earliest Start Date |
ESI | Employee satisfaction Index or Early Supplier Involvement |
ESPP | Employee Stock Purchase Program |
ESR | Engineering shift report |
ESS | Environmental stress screening (thermal or physical) – all parts testing. |
EST | Environmental stress test – sample test |
EST | Earliest Start Time |
ETC | Estimate To Complete |
EU | European Union |
EVA | Earned Value Analysis |
EVT | Engineering verification test |
F / N | Fichier neutre (term is used on Sagem account) |
F / T | Functional test |
F4G | Fuji fourth generation |
FA | Failure analysis or Fixed asset |
FAA | Federal Aviation Administration |
FAC | Forced air convection |
FAI | First article inspection |
FAIL | Fixed asset in leasing |
FAQ | Frequently asked questions or Free alongside quay |
FAR | Failure analysis report |
FAS | Free alongside ship |
FATF | File allocation table file or Fabmaster ASCII transfer format |
FC & S | Free of capture and seizure |
FCC | Federal Communications Commissions (U.S.A.) |
FCE | First Certificate in English |
FCM | Fast component mounter |
FCM II | Fast component mounter mark II |
FCS | First customer ship |
FCT | Functional card test or Flip chip technology |
FCU | Furnace Control Unit |
FDA | Federal drug and alcohol commission |
FEA | Finite element analysis |
FED | Field emission displays |
FEM | Finite element modeling |
FET | Field effect transistor |
FF | Finish-To-Finish (type of task relationship in Microsoft Project) |
FF | Free Float |
FFA | Fixed fiducial alignment (FCM Philips machines) |
FGI | Finished goods inventory |
FH | Fixture head |
FHM | For him magazine |
FIAT | Failure in Italian Automotive Technology |
FIAT | Fix It All the Time |
FIAT | Fix it again, Tony! |
FIFO | First in – first out |
FILO | First in – last out |
FIP | Fuji interlaced placer or Fiche d’instruction de post (Sagem) |
FIS | Factory information system |
FLEX | Flextronics (Solectron’s competitor) |
FLS | Front Line State |
FLSA | Fair labor standard act |
FLT | Full liquidus temperature |
FMA | Failure Mode Analysis |
FMEA | Failure mode and effects analysis |
FMI | Foreign Machine Interface (DeK machine) |
FNET | Finish No Earlier Than (semi-flexible constraint in Microsoft Project) |
FNLT | Finish No Later Than (semi-flexible constraint in Microsoft Project) |
FOB | Free on board |
FOP | Fineness of print (stencil) |
FORD | Fix or repair daily |
FORD | First On Recall Day |
FORD | First On Rust and Deterioration |
FORD | Found On Road, Dead |
FORD | Fault Of R&D |
FORD | Fast Only Rolling Downhill |
FORD | Features O.J. and Ron’s DNA |
FOV | Field of vision |
FOW | Free on waggon |
FP | Fine pitch |
FP | Factory Planner |
FPBGA | Fine pitch ball grid array |
FPF | First pass fail |
FPGA | Field programmable gate array |
FPP | First pass pass |
FPT | Flying Probe Tester OR Fine pitch technology |
FQ | Fine theta (on CP6 Fuji machines) |
FQP | Fuji compact placer |
FR | Failure rate |
FRU | Field replaceable unit |
FRY | For your reference |
FS | Finish-To-Start (type of task relationship in Microsoft Project) |
FT | Functional test |
FTC | First Time Capability |
FTIR | Fourier transform infrared spectroscopy |
FTP | File transfer protocol |
FVS | Functional Verification (Test) |
FVT | Functional verification test |
FYE | For your education |
FYI | For your information |
FZ | Franc Zone |
G / A | General Average |
G / L | General ledger |
G-3 | Group of Three |
G-7 | Group of Seven |
G-8 | Group of Eight |
GA | General availability |
GAAP | Generally accepted accounting principles |
GaAs | Gallium arsenide |
GALI | Global American Language Institute |
GAM | Global account manager |
GAP | General administrative procedure |
GASC | Global Account Supply Chain |
GBP | Great Britain pound |
GCC | Gulf Co-operation Council |
GDF | Generic data file |
GEM | Generic Equipment Model |
GenCAD | Generic CAD format (on FCM Philips machines) |
Geplacea | Group of Latin American and Caribbean Sugar Exporting Countries |
GERT | Graphical Evaluation and Review Technique |
GIF | Graphics interchange format |
GIGO | Garbage input garbage output |
GM | General manager |
GM | General Maintenance |
GMC | Garage Man’s Companion |
GMC | Got A Mechanic Coming? |
GPA | Graphics port accelerator |
GPA | Grade Point Average |
GPA | Gas Processors Association |
GPA | Gas Producers Association |
GPA | Gay Pilots Association |
GPA | General Partitioning Algorithm |
GPA | General Purpose Analysis |
GPA | Geophysical Altimeter |
GPA | Georgia Association of Planetariums |
GPA | Gigapascal |
GPA | Government Property Administrator |
GPA | Governmental and Public Affairs |
GPA | Graphics Performance Accelerator |
GPA | Green Point Average |
GPA | Guidance Platform Assembly |
GPM | General purpose module (FCM Philips machines) |
GPRS | General Packet Radio Service |
GPS | General power supply or Global positioning system |
GR&R | Gage Repeatability & Reproducibility |
GSBU | Global Services Business Unit |
GSM | Global System for Mobile Communications |
GSP | Generalized system of preferences (trade agreement) |
GUI | Graphical user interface |
GWS | Gabriel Wilhelm Sohlberg |
H / L | Handload |
H / P | Handphone |
HAL | Hot air leveling |
HALT | Highly accelerated lifetime test |
HAP | Heated Air Plenum |
HASL | Hot air solder levelling – raw P.W.B. surface finish |
HASS | High acceleration stress screening |
HCB | High complexity board |
HCFC | Hydro Chloro Fluoro Carbons |
HDTV | High-density television |
HFC | Hydro Fluoro Carbons |
HFE | Hydro Fluoro Ethers |
HMU | Hot muck-up |
HMV | Hot Mock-up Verification (Test) |
HONDA | Had One Never Did Again |
HOSHIN | Top-down objective tracking (C.E.O. through sites) |
HP | Hewlett Packard |
HPU | Hours per unit |
HR | Human resources |
HS | Health & Safety |
HT | Handy terminal (Fuji machines) |
HTS Code | Harmonized traffic system |
HVSD | High-volume systems division |
HYUNDAI | Hope You Understand Nothing’s Driveable And Inexpensive… |
I – NUB | Increase netable unit build |
I / O | Input / Output |
I/O | Input/output |
IALF | Item action log form |
IAW | In accordance with |
IBEC | International Bank for Economic Co-operation |
IBM | International business machines |
IBP | Initial business process |
IBRD | International Bank for Reconstruction and Development |
IC | Integrated circuit |
ICAM | Integrated computer-aided manufacturing |
ICAR | Internal corrective action request |
ICB | International Competence Baseline |
ICC | International competence center |
ICC | International Chamber of Commerce |
ICEA | Insulated Cable Engineers Association |
ICFTU | International Confederation of Free Trade Unions |
ICM | Interface control module (on Q.P.242 Fuji machines) |
ICO | Islamic Conference Organization |
ICP | Internal control program |
ICR | Internal change revision |
ICSI | Internal customer satisfaction index |
ICT | In-circuit test or Integrated circuit test |
ID | Inner diameter |
IDB | Inter-American Development Bank |
IDC | Insulation displacement connector (contacts pierce conductor insulation) |
IDL | Incremental dirt level |
IDM | Indirect material |
IEC | International Electrotechnical Commission |
IECQ | International Electronic Component Qualification System |
IEEE | Institute of Electrical and Electronic Engineers |
IEPS | International Electronic Packaging Society |
IFB | Invitation for Bid |
IFIR | Initial field incident rate |
IGADD | Inter-Government Authority on Drought and Development |
IL | Integration line |
ILB | Inner lead bonding |
ILS | Integrated Logistic Support |
IM | Ingram Micro (Solectron’s competitor) |
IMAC | Install, move, add, change |
IMC | Intermetallic compound |
IMF | International Monetary Fund |
IMF | Industrial Mission Formation |
InGaAs | Indium Gallium Arsenide detector |
IOC | Indian Ocean Commission |
IORS | Individual overtime record sheet |
IPC | Institute for interconnecting and packaging electronic circuits |
ipm | Inches per minute |
IPMA | International Project Management Association |
IPO | Interactive process optimization |
IQA | Incoming quality assurance |
IQC | In-coming quality check |
IR | Infrared |
IRDs | Integrated receivers and decoders |
IRSI | Intelligent Reasoning Systems Inc. |
IS | Information systems |
ISA | Instrument Society of America |
ISDN | Integrated services digital network |
ISF | Intelligent stick feeder |
ISHM | International Society for Hybrid Microelectronics |
ISO | International standards organization |
ISP | Internet Service Provider or Internet Service Purveyor |
ISST | Information services, systems and technology |
IST | In-situation stress test |
IT | Information technology |
ITF | Intelligent tape feeder |
ITR | Inbound Traffic Responsible |
ITSS | Information technology & systems services |
JBL | Jabil Circuit (Solectron’s competitor) |
JD | Job description |
JEDEC | Joint Electronic Device Engineering Council |
JFK | John Fitzgerald Kennedy |
JIT | Just in time |
JOT | Just on time |
JP(E)G | Joint photographic experts group |
JTAG | Joint Test Action Group |
KGB | Known good board |
KGD | Known good die |
KITA | Kick in the ass |
KLT | Kheng Loon TAN (K.L. TAN) |
KO | Knock out |
KPA | Key personal analyze |
L / C | Letter of credit |
LA | Laser align (FCM Philips machines) |
LAM | Laser align module (FCM Philips machines) |
LAN | Local area network |
LAR | Lot acceptance rate |
LAS | Laser align system (FCM Philips machines) |
LC | Labor cost |
LCB | Low complexity board |
LCBC | Lake Chad Basin Commission |
LCC | Leadless chip carrier |
LCCC | Leaded ceramic chip carrier |
LCD | Liquid crystal display |
LCL | Lower control limit |
LCSOC | Leadless chip socket |
LED | Light emitting diode |
LEO | Lands exposed only |
LEP | Leading edge procurement |
LET | Latest Event Time |
LFA | Logical Framework Approach |
LFD | Latest Finish Date |
LFMA | Light flexible mechanical assembly |
LFT | Latest Finish Time |
LGA | Land grid array |
LID | Leadless inverted device |
LIF | Low insertion force |
LIFO | Last in – first out |
LLCC | Leadless ceramic chip carrier |
LLL | Laser lead locator (on Fuji machines) |
LMS | Le Mans |
LN | Deutsche Luft und Raumfahrt Norm |
LOA | Letter of authorization |
LP | Low productivity |
LPST | Last Possible Start Time |
LR | Labor revenue |
LRC | Line Readiness Checklist (F-09-0024) |
LRP | Long range plan |
LSD | Latest Start Date |
LSI | Large scale integration |
LSL | Lower specification limit |
LST | Latest Start Time |
LT | Lead time |
LTB | Last time buy |
LVHM | Low volume high mix |
M / C | Machine (in Fuji manuals) |
MAP | Manufacturing automation protocol |
MAZDA | Most Always Zipping Dangerously Along |
MBA | Master business administration |
MBB | Moisture barrier bag |
MBNQA | Malcolm Baldrige National Quality Award |
MC | Mission critical |
MCAD | Mechanical computer-aided design |
MCAE | Mechanical computer-aided engineering |
MCB | Medium complexity board |
MCDBA | Microsoft Certified Database Administrator |
MCM | Multichip module |
MCM-C | Multi-chip module ceramic |
MCM-D | Multi-chip module deposited |
MCM-L | Multi-chip module laminate |
MCN | Manufacturing Change Note |
MCOS | Material cost of sales |
MCP | Microsoft Certified Professional |
MCR | Master control relay |
MCS | Machine control system (on Fuji machines) |
MCSD | Microsoft Certified Solutions Developer |
MCSE | Microsoft Certified Systems Engineer |
MCT | Manufacturing cycle time or Microsoft Certified Trainer |
MDA | Manufacturing defect analyzer |
MDB | Microsoft database |
MDF | Manufacturing data format (on FCM Philips machines) |
MDF | Main Distribution Frame |
MDF | Macro-Defect-Free |
MDF | Macular Degeneration Foundation |
MDF | Main Data Feed |
MDF | Main Distribution Frequency |
MDF | Main Distribution(al) Facility |
MDF | Manic Depression Fellowship (UK) |
MDF | Manipulator Development Facility |
MDF | Manual Dial Facility |
MDF | Maritime Defense Force |
MDF | Marketing Development Funds |
MDF | Mason Dixon Farms, Inc. (Gettysburg, Pennsylvania) |
MDF | Master Data File |
MDF | Material Discrepancy Form |
MDF | Materiel Distribution Forecasting |
MDF | Medium Density Fiber |
MDF | Medium Density Fibreboard |
MDF | Mendelsohn Difference Family |
MDF | Mild Detonating Fuse |
MDF | Mission Data Folders |
MDF | Monitor Definition File |
MDF | Morte Di Fame (Italian: Dying of Hunger) |
MDF | Mule Deer Foundation |
MDF | Multiband Direction Finder |
MDF | Multisensor Data Fusion |
MDI | Multi-document interface (on Fuji machines) |
MDS | Mechanical deflection system |
ME | Manufacturing engineer or Mechanical engineer or Mission essential |
MEA | Monoethanol amine |
MELF | Metalized electrode faced transistor |
MES | Manufacturing execution system (floor control systems) |
MFO | Must Finish On (inflexible constraint in Microsoft Project) |
MFU | Multi feeder unit |
MIL | Military |
miniBGA | Mini ball grid array |
MINT | Motion INTerpreter |
MIR | Moisture insulation resistance |
MIS | Manufacturing information systems |
MIS | Manufacturing information system (FCM Philips machines) |
MLB | Multi-layer board |
MLM | Multi-layer metal |
MLPWB | Multilayer printed wiring board |
MMI | Man Machine Interface |
MNR | Multiple network resistor |
MO | Money order |
MOC | Microsoft Oficial Curriculum |
MODAPTS | MODular Arrangement of Predetermined Time Standards |
MOL | Maintenance on line |
MOL | Mac on Linux |
MOL | Machine Oriented Language |
MOL | Manned Orbital Laboratory |
MOL | Märkisch-Oderland (region in East Germany) |
MOL | Maximum Order Limitations |
MOL | Maximum Ordering Limit |
MOL | Maximum Output Level |
MOL | Method of Layers |
MOL | Minimum Operating Level |
MOL | Molde, Norway – Aro (Airport Code) |
MOL | Mole |
MOL | More Or Less |
MOP | Method Of Potentials |
MOS | Metal oxide semiconductor |
MOSFET | Metal-oxide semiconductor field effect transistor |
MOUS | Microsoft Office User Specialist |
MPE | Manufacturing project engineer or Manufacturing product engineer |
MPEG | Moving pictures expert group |
MPG | Machine program generator |
MPI | Manufacturing process instruction |
MPM | Manufacturing printing machine |
MPN | Manufacturer part number |
MPP | Manufacturing production plan |
MPRE | Manufacturing product engineer |
MPS | Material planning system or Master production schedule |
MPX | Multiplex channel (on Q.P.242 Fuji machine) |
MQS | Material quotation system |
MR | Magneto resistive |
MRB | Material review board |
MRO | Maintenance, repair, operation |
MRP | Material requirements planning |
MS | Material shortage |
MSCC | Material supply chain cost |
MSCM | Material supply chain manager |
MSD | Moisture sensitive device |
MSI | Medium-scale integration (up to 1000 transistors) |
MSL | Moisture sensitive level |
MSO | Must Start On (inflexible constraint in Microsoft Project) |
MSRP | Modelling simulation and rapid prototyping |
MTBF | Mean time before failure or Mean time between failure |
MTOPS | Millions of theoretical operations per second |
MTTF | Mean time to failure |
MTTR | Mean time to repair |
MTU | Multi tray unit |
MTX | Mobile Telephone eXchange |
MUP | Multi-user pipette (FCM Philips machines) |
MVC | Most vulnerable component |
MVI | Manual visual inspection |
N / A | Not applicable |
N / C | Numerical control |
NACC | North Atlantic Co-operation Council |
NADCAP | National Aerospace and Defense Contractors Accreditation Procedures |
NAFTA | North American Free Trade Agreement |
NAM | Non-aligned Movement |
NASA | National Aeronautics and Space Administration |
NAT | Nozzle arrangement table (Fuji machines) |
NATO | North Atlantic Treaty Organization |
NAY | Not available yet |
NBS | National Bureau of Standards |
NC | Nozzle changer (on Fuji machines) |
NCB | National Competence Baseline |
NCM | Non-conforming material |
NCT | Nozzle center test |
NDF | No defect found |
NDT | Non-destructive testing |
NEL | NatSteel (Solectron’s competitor) |
NEMA | National Electrical Manufactures Association |
NEMI | National Electronics Manufacturing Initiative |
NFF | No Fault Found |
NFPA | National Fire Protection Association |
NG | No good (on S.M.T. Fuji machines) |
NIBBLE | String of 4 bits = ½ BYTE |
NIC | Network interface card |
NIS | National Institute of Standards |
NIST | National Fire Protection Association |
nMOS | n-Type Metal oxide silicon |
NMR | Normal mode rejection |
NORD | NO Reference Designator |
nPB | n-Propyl bromide |
NPI | New products introduction |
NPN | Non-intelligent part number |
NPV | Net Present Value |
NRA | No receivable area |
NRE | Non-recurring expense or Non-recoverable error |
NSC | National service center |
NTAI | Nam Tai (Solectron’s competitor) |
NWS | Non-Working Sample |
O / E | Optoelectronics |
OA | Organic activated |
OAP | Order acceptance procedure |
OAPEC | Organization of Arab Petroleum Exporting Countries |
OAS | Organization of American States |
OAU | Organization of African Unity |
OBS | Organizational Breakdown Structure |
OCAP | Out-of-control action plan |
OD | Outer diameter |
ODBC | Open database connectivity |
ODM | Original design manufacture or Ozone depleting materials |
ODP | Ozone depletion potential |
OECD | Organization for Economic Co-operation and Development |
OECS | Organization of Eastern Caribbean States |
OEIC | Optical electronic integrated circuit detector |
OEM | Original equipment manufacturer |
OEMS | Order Entry Management System |
OIC | Organization of the Islamic Conference |
OJT | On job training |
OLB | Outer lead bonding |
OLDSMOBILE | Old Ladies Driving Slowly Make Others Behind Infuriatingly Late Every day. |
OLDSMOBILE | Overpriced, Leisurely Driven Sedan Made Of Buick’s Irregular Leftover Equipment |
OLK | Outlook |
OMPAC | Over molded pad array carrier |
OMVG | Gambia River Development Organization |
OMVS | Senegal River Development Organization |
OOB | Out of box |
OOBA | Out of box audit |
OOC | Out of control |
OODA | Observe, orient, decide, act – C.F.T. process |
OOO | Out of order |
OP | Operational |
OPC | Operational production center |
OPEC | Organization of Petroleum Exporting Countries |
OQI | Outgoing Quality Inspection |
OR | Owner’s risk |
ORT | On-going reliability test |
OSD | On-screen digital |
OSF | Opened Society Foundation |
OSHA | Occupational Safety and Health Administration |
OSN | Out-of-specification notice |
OT | Over time or Overtravel |
OTD | On-time delivery |
OTP | One time programmable |
P & L | Profit and loss |
P / A | Preventive action |
P / I | Packaging and interconnection |
PAC | Pad array carrier or PLAN D’ACTIONS CORRECTIVES (Philips terminology) |
PAO | Pickup auto offset (Q.P.242 Fuji machines) |
Parlacen | Central American Parliament |
PAT | Profit after taxes |
PB | Project Buyer |
PBC | Plated and bonded copper or PHILIPS business class |
PBET | Performance-Based Equipment Training |
PBGA | Plastic ball grid array |
PBOM | Planning bill of material or Production bill of material |
PBS | Product Breakdown Structure |
PBT | Profit before taxes |
PC | Production control or Personal computer |
PC | Percent Complete |
PCA | Printed circuit assembly |
PCB | Printed circuit board |
PCBA | Printed circuit board assembly |
PCC | Philips Consumer Communication |
PCDIU | Personal Computer Display Input Unit |
PCE | Per chloro ethylene |
PCI | Peripheral component interconnect or Prime customer interface |
PCMCIA | Personal Computer Memory Card International Association |
PCO | Production change order (Sagem) |
PCO | Production Control Operator |
PCR | Production change request |
PCT | Planned Completion Time |
PD | Part data or Paid |
PDCA | Process Deployment Common Activities |
PDCA | Plan, Do, Check, Act |
PDCA | Please don’t change anything (:-)) |
Portable document format | |
PDM | Production data management or Patient Monitoring Division |
PDM | Precedence Diagramming Method |
PE | Project engineer or Product engineer |
PEM | Plastic encapsulated microcircuits or Preventive equipment maintenance |
PERT | Program Evaluation and Review Technique |
PET | Preliminary English Test |
PET | Planned End Time |
PF | Process functional |
PF&D | Personal, Fatigue & Delay |
PFC | Per Fluoro Carbons |
PFMEA | Process Failure Mode and Effects Analysis |
PFO | Profit for operations |
PFU | Power feeder unit (on Q.P.132 Fuji machine) |
PGA | Pin grid array |
PI | Physical inventory |
PIC | Passive Improvement Contract |
PIM | Parts information manager (on FCM Philips machines) |
PIP | Pick and placement module (FCM Philips machines) |
PIR | Pilot run (Philips terminology) |
PLC | Programmable logic controller |
PLCC | Plastic leaded chip carrier |
PLM | Placing module (on Q.P. Fuji machines) |
PLSOC | Plastic leaded socket |
PLXS | Plexus (Solectron’s competitor) |
PM | Project manager or Placing module (on FCM Philips machines) |
PM | Programme Manager or Project Management |
PMBOK | Project Management Body Of Knowledge |
PMC | Placing module controller (on Q.P. Fuji machines) |
PMI | Process manufacturing instruction |
PMI | Project Management Institute |
PMO | Program management office |
PMP | Process manufacturing plan (Compaq) |
PMP | Project Management Professional |
PN | Part number |
PnP | Plug and Play |
PO | Purchase order |
POC | Process, organization, culture. |
POD | Payment on delivery |
POI | Parallel optical interconnects |
POR | Purchase Order Request |
POST – IR | POST – infrared |
POTW | Publicly owned-treatment works |
POV | Partition of variation |
PPA / SI | Post-pack audit / Source inspection |
PPB | Basic productive process (see BPP for English translation) |
PPC | Placing pressure control (on Fuji placement machines) |
PPD | Prepaid |
PPM | Parts per million |
PPPN | Per person, per night |
PPS | Production preparation software or Production preparation system (FCM Philips machines) |
PPS – Pro | Production preparation software – professional version (FCM Philips machines) |
ppt | Parts per trillion |
PPU | Placement phi unit (FCM Philips machines) |
PPV | Purchase price variance |
PQ | Pre theta (on CP6 Fuji machines) |
PQE | Product quality engineer |
PQIS | Procurement quality plan |
PQP | Process quality plan (internal) |
PQP | Product Quality Planning |
PQPT | Product Quality Planning Team |
PR | Pilot run |
PRE – IR | Pre – infrared |
PROM | Programmable read-only memory |
PRT | Product realization team |
PRU | Prix revient unitaire |
PSA | Pressure sensitive adhesive |
PSD | Particle-size distribution |
PSI | Part-specific information (on FCM Philips machines) |
psia | Pounds per square inch absolute |
psig | Gauge pressure in pounds per square inch (pressure relative to ambient pressure) |
PSO | Preliminary sales order |
PST | Planned Start Time |
PSTN | Public Switched Telephone Network |
PTA | Preferential Trade Area for Eastern and Southern African States |
PTH | Pin through hole |
PTPS | Parker Team Player Survey |
PTY | ProTotYpe |
PVT | Pilot verification trial |
PWA | Printed wiring assembly |
PWB | Printed wired board |
QA | Quality assurance |
QAF | Quality Alert Form |
QAS | Quality assessment schedule |
QBE | Query by example |
QBR | Quarterly business review |
QC | Quality Control |
QCC | Quality control cosmetic (on DeTeWe line) |
QFD | Quality Function Deployment |
QFP | Quad flat pack |
QIP | Quality improvement process |
QIS | Quality improvement skills |
QIT | Quality improvement training |
QMS | Quality management system |
QOH | Quantity on hand |
QP | Quality partners or Quality placement |
QPI | Quality productivity improvement |
QPL | Qualified products list |
QSR | Quality system report |
QSR | Quality System Requirements |
QTY | Quantity |
QUBA | Qualification build assembly |
R & O | Risk and opportunity |
R & S | Rhode & Schwartz |
R / O | Read-only |
R / W | Read/write |
RA | Rosin-activated |
RAFA | Repair after final assembly (on Sagem line) |
RAI | Repair after integration (on DeTeWe line) |
RAM | Random access memory |
RAM | Responsibility Assignment Matrix |
RAMBUS | Re Access Memory Bus (memory) |
RAS | Reliability, availability, serviceability of a product |
RBS | Resource Breakdown Structure |
RCA | Root cause analysis |
RCD | Row Customer Demand |
RCE | Region center Europe |
RCO | Rolling changeover (FCM Philips machines) |
RDI | Real Dead Item |
RDU | Remaining Duration |
RDY | Ready |
REA | Request for engineering action |
RegPM | Registered Project Management |
REM | Rapid Eye Movement |
REV | Solectron controlled revision (of Customer part number) |
RF | Radiofrequency |
RFI | Radio frequency interference |
RFP | Ready for purchase |
RFP | Request For Proposal |
RFQ | Request for quote |
RFq | Reverse fine theta |
RFQ | Request For Quotation |
RFT | Right First Time |
RGB | Red Green Blue |
RH | Relative humidity |
RISC | Reduced instruction set chip |
RLR | Received loudness ratio (on Final test equipment) |
RMA | Returned material authorization or Rosin mildly activated |
RNIS | Réseau Numerique (à ) Integration (de) Services [French for ISDN] |
ROA | Return on assets (facilities, equipment, cash) |
ROM | Read-only memory |
ROT | Reflow of through-hole |
RP | Request to purchase or Replay paid |
rpm | Revolutions per minute |
RPN | Risk priority number |
RPT | Raw process time |
RRD | Returns and reported deficiencies |
RS | Remote site |
RSA | Rosin super activated |
RSL | Recommended supplier list |
RSSI | Receiving strength signal indicator |
RTG | Resistance To Ground |
RTN | Rattle noise |
RTS | Return to supplier or Ready to ship |
RTV | Returned to vendor |
SA | Synthetic-activated |
SA0 | Stock at 0 |
SA1 | Stock at 1 |
SAAB | Send Another Automobile Back |
SAAB | Swedish Automobiles Always Breakdown. |
SAARC | South Asian Association for Regional Co-operation |
SADC | Southern African Development Community |
SANM | Sanmina (Solectron’s competitor) |
SAP | Systems applications products (in data processing) |
SARS | Severe Acute Respiratory Syndrome |
SBC | Solder ball connect |
SBE | Supplier based engineering |
SBIP | Single board image processor (FCM Philips machines) |
SBM | Supply base management or Systems based management |
SCAR | Supplier correction action request |
scfh | Standard cubic feet per hour |
SCI | SCI Systems (Solectron’s competitor) |
SCIM | Small computer interface module |
SCP | Single-chip package |
SCR | Silicon controlled rectifiers |
SCS | Setup control system (FCM Philips machines) |
SCSI | Small computer system interface |
SCU | Servo control unit or Sub-controller unit (on Fuji machines) |
SDC | Solectron design center |
SDE | Scope Definition Element |
SDE | Secure Data Exchange |
SDE | Shared Data Environment |
SDE | Signal Display Editor |
SDE | Signal Distribution Equipment |
SDE | Simple Delay Equalization (Hekimian) |
SDE | Simulated During Exercise |
SDE | Software Demonstration Evaluation |
SDE | Software Design Engineer |
SDE | Software Development Engineer |
SDE | Software Development Environment |
SDE | Spatial Database Engine |
SDE | Standard Data Element |
SDE | Statistical Design of Experiments |
SDE | Stochastic Differential Equation |
SDE | Submission and Delivery Entity (ITU-T) |
SDE | Support Data Extension |
SDE | Susquehanna Diversified Engineering |
SDE | System Development Environment |
SDE | Supplier Development Engineer |
SDWT | Self-directed work team |
SE & O | Sauf erreurs et omissions |
SEC | Securities exchange commission |
SECS | Semiconductor equipment communications standard |
SECS II | Semiconductor equipment communications standard – Part II (FCM Philips machines) |
SELA | Latin American Economic System |
SEM | Scanning electron microscope |
SF | Start-To-Finish (type of task relationship in Microsoft Project) |
SFAI | Supplier’s first article inspection |
SFC | Shop floor control |
SFDM | Shop Floor Data Management |
SFI | Shopfloor implementation |
SFMEA | System Failure Mode and Effects Analysis |
SG&A | Sales General & Admin |
SI | Systeme International d’Unites |
SIA | Semiconductor industry association |
SIC | Station instruction card or Standard industry classification |
SIMM | Single in-line memory module |
SIMS | Solectron integrated manufacturing system |
SIP | Single in-line package |
SIPOC | Supplier, Input, Process, Output, Customer |
SIR | Surface insulation resistance |
SITD | System integration and test division |
SITEQ | Solectron integrated tracking environment for Quality |
SLICC | Slightly larger than integrated circuit carrier |
SLM | Supply line management |
SLR | SOLECTRON (symbol on New York stock exchange) or Send loudness ratio (on Final test equipment) |
SMA | Surface mount assembly |
SMART | Save money, action, resources and time. |
SMC | Surface mount component |
SMD | Surface mount device |
SME | Subject matter expert |
SMEMA | Surface Mount Equipment Manufacturers Association |
SMILE | Translates customer data into Pick and place data for S.M.T. line |
SMOBC | Solder mask over bare copper |
SMT | Surface mount technology |
SMTA | Surface Mount Technology Association |
SMV | Standard Medium Variance |
SN | Serial number |
SNET | Start No Earlier Than (semi-flexible constraint in Microsoft Project) |
SNLT | Start No Later Than (semi-flexible constraint in Microsoft Project) |
SO | Small outline |
SOD | Small outline diode |
SOIC | Small outline integrated circuit |
SOJ | Small outline I.C. with J leads |
SOL | Small outline large (body) |
SOP | Small outline package |
SOP | Standard Operation Plan |
SOS | Small outline specials or Save Our Souls |
SOT | Small outline transistor |
SOW | Small outline wide (body) |
SOW | Statement Of Work |
SP | Service pack (on FCM Philips machines) |
SPC | Statistical Process Control |
SPC | South Pacific Commission |
SPD | Shipment per person per day or Sales per direct |
SPE | Lithium-ion solid polymer electrodes (batteries) |
SPF | South Pacific Forum |
SPI | Schedule Performance Index (EVA term) |
SPN | Solectron part number |
SPQL | Shipped product quality level |
SPRS | Single-pass reflow soldering |
SQACAR | Supplier quality assurance corrective action request |
SQC | Statistical quality control |
SQE | Supplier quality engineer |
SQL | Structured query language |
SQM | Solectron quality manual |
SQP | Statistical quality process |
SQT | Structured query tool |
SRAM | Static random access memory |
SS | Start-To-Start (type of task relationship in Microsoft Project) |
SSD | Solid solder deposition |
SSG | Systems and services group |
SSI | Small-scale integration (up to 100 transistors) |
SSOP | Shrink small outline package |
SSR | Standard setup report or Station shift report |
SST | Silicon Storage Technology |
STARS | Shopfloor tracking and reporting system |
STB | Still To Build |
STC | Solectron technical center |
STQEA | Solectron Total Quality Excellence Award |
STU | Single tray unit (on Q.P. Fuji machines) |
SV | Schedule Variance (EVA term) |
SVGA | Super video graphics adapter |
SVS | Synthetic vision system (used for defect detection) |
SWOT | Strengths, Weaknesses, Opportunities, Threats |
SWP | Standard work procedure |
T | Temperature |
TAB | Tape automated bonding |
TAM | Total available market or Telephone answering machine |
TBC | To be checked or To be confirmed |
TBD | To be defined or To be determined |
TBF | Twin bulb feeder (on FCM Philips machines) or To be fired |
TBGA | Tape ball grid array or Thermal ball grid array. |
TBH | To be hired |
TBR | To be replaced |
TBU | To be updated |
Tbulk | Twin bulk (on FCM Philips machines) |
TC | Transport controller (FCM Philips machines) |
TCC | Temperature coefficient of capacitance |
TCE | Thermal coefficient of expansion or Trichloroethane |
TCN | Temporary change notice or Telefono cordless numerico |
TCO | Total cost of ownership or Temporary change order |
TCP | Tape carrier package (is another name for TAB) or Transmission control protocol |
TCP / IP | Transmission control protocol / Internet protocol |
TCR | Temperature coefficient of resistance |
TCS | Total customer satisfaction |
TCU | Temperature Control Unit |
TDMA | Time division multiplies access |
TDO | Table of denial orders |
TDR | Time demand reflect (days of material in hub, goal = 10) |
TE | Test Engineer |
TEU | Toolbit exchange unit |
TF | Total Float |
TGA | Thermogravimetric analyzer |
TGIF | Thank God is Friday |
TGR | Things Gone Right |
TGW | Things Gone Wrong |
TH | Tooling hole |
THD | Third harmonic distortion |
THT | Through-hole technology |
TIB | Temporary import in bond (Trade agreement) |
TIG | Technology implementation group |
TIM | Test, inspection and measurement |
TLO | Terminal learning objective (on FCM Philips machines) or Total loss only |
TOS | Type of Service |
TOYOTA | Too Often Yankees Overprice This Auto |
TPE | Transfer Project Engineer |
TPI | Test process instruction |
TPM | Technical project manager |
TPM | Technical Production Meeting |
TPR | Technique de Plastic Roumaine |
TPS | Toyota Production System |
TPT | Total process time |
TPU | Tape pack unit (on Fuji machines) |
TQ | Tel quel = tale quale = just as the goods |
TQC | Total quality control |
TQFP | Thin quad flat pack |
TQM | Total quality management |
TRR | Trial run request |
TRRPL | Trial run request in production line |
TRS | Turbo Reflow Solder |
TSB | Target share of business (with suppliers) |
TSBU | Technology solutions business unit |
TSCPA | Tennessee Society of Certified Public Accountants |
TSCR | Temporary Sagem change request |
TSOP | Thin small outline package |
TSSOP | Thin shrink small outline package |
TTL | Transistor-to-transistor logic |
TTL | Time To Live |
TU | Touch up |
TUV | Technisher uberwachungs verein |
TWG | Technology working group |
UC | Unit cost |
UCL | Upper control limit |
UDEAC | Central African Customs and Economic Union |
UDMA | Ultra direct memory access |
UES | User Earth Station |
UFPT | Ultra fine pitch technology |
UL | Underwriters Laboratory |
ULSI | Ultra large-scale integration (exceeds 1 million transistors) |
UMC | Unit manufacturing cost |
UN | United Nations |
UPS | Uninterruptible Power Supply or United Parcel Service (transport company) |
URL | Uniform Resource Locator |
USA | United States of America |
USI | Unscheduled issues |
USL | Upper specification limit |
USR | U.S. Robotics |
UUT | Unit under test |
V | Volt |
VAC | Variance at Completion |
VAR | Value added reseller |
VAT | Value added tax |
VBA | Visual basic for applications |
VBE | Visual Basic editor |
VCD | Various center distance |
VDE | German / European safety standards |
VDR | Verify defect repair |
VDU | Video Display Unit |
VE/VA | Value Engineering/Value Analysis |
VER | Solectron assigned unique 2 digit version code |
VG | Verteidigungasgerte Norm |
VGA | Video graphics adapter |
VH1 | Video hits 1 |
VI | Visual inspection |
VIAFA | Visual inspection after Final assembly |
VIAM | Visual inspection after milling |
VIAMI | Visual inspection after Manual insertion |
VIAR | Visual inspection after reflow |
VIBR | Visual inspection before reflow |
VIFIR | Dell field returns |
VLRR | Verified Line Reject Rate (Dell line fallout returns) |
VLSI | Very large-scale integrated circuits (up to 1 million transistors) or Very large scale integration |
VMI | Vendor managed inventory |
VMS | Volatile methyl-siloxanes |
VOC | Volatile organic compound |
vol | Volume |
VOLVO | Very Odd-Looking Vehicular Object |
VPS | Vapor phase soldering |
VR | Voltage regulator |
VRAM | Video random access memory |
VRM | Voltage regulator module (controls voltage into processor)* |
VSPA | Very small peripheral array |
VTU | View & Touch up. |
VUE | Virtual University Enterprises |
VW | Virtually Worthless |
W | Watt |
W / B | Way bill |
W / O | Work order |
W / W | Warehouse warrant |
WA | With average |
WAC | Weighted average cost |
WAN | Wide area network |
WAP | Wireless Application Protocol |
WB | Waybill |
WBR | Weekly business review |
WBR | With Best Regards |
WBS | Work breakdown structure |
WC | Work cell or Water closet |
WEU | Western European Union |
WG | Weight guaranteed |
WH | Warehouse |
WHO | World Health Organization |
WI | Wettability index |
WIIFM | What’s in it for me (PPS Pro manual – for Philips machines) |
WIP | Work in progress |
WMD | Weller multi digital |
WORD | Word size of a given computer (8 bits or 18 bits, or 32 bits etc.) |
WPA | With particular average |
WPM | Wide placement module (FCM Philips machines) |
WRAM | Windows random access memory |
WTC | World Trade Center |
WVM | Wide vision module (FCM Philips machines) |
WW | World wide |
WWMS | Worldwide materials system |
WWW | World wide web |
WYSIWYG | What you see is what you get |
X’fer | Transfer |
XPI | Customer electronic design data for CADDIE |
Y2K | The year 2000 |
ZFT | Zero-failure throughput |
ZIF | Zero insertion force (connector) |
ZIP | Zig-zag in-line package (socket) |
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