| 0 |
Angular measure; degree |
| 0C |
Degree Celsius/centigrade |
| 0F |
Degree Fahrenheit |
| 2DI |
Two Dimensional Inspection (on Screen printing machines) |
| 3D |
Three-dimensional |
| 3DPM |
3 Dimensional Packaging Module |
| 5 S |
Seiri (Organization or sort), Seiton (Orderliness or arrange), Seisou (Cleanliness), Seiketsu (Standardized cleanup), Shitsuke (Discipline) |
| A |
Ampere |
| A / D |
After date |
| A / I |
Automatic insertion |
| A / P |
Accounts payable |
| A / R |
Accounts receivable or All risks |
| A / S |
After sight |
| AAGR |
Average annual growth rate |
| AAR |
Against all risks |
| ABC |
Activity-based costing |
| ABP |
Active Business Partners |
| ABS |
Acrylonitrile-butadiene-styrene (plastic) or antiblocking system |
| ac |
Alternating current |
| AC |
Alternating current |
| ACAR |
Audit corrective action request |
| ACI |
Axial circuit insertion |
| ACM |
Advanced component mounter (Philips machine) |
| ACP |
African, Caribbean and Pacific Countries |
| ACWP |
Actual Cost of Work Performed (EVA term) |
| AD |
After date |
| ADB |
Asian Development Bank |
| ADL |
Allowable dirt level |
| ADM |
Activity Diagram Method |
| ADP |
Avis de depannage provisoire |
| AEC |
African Economic Community |
| AEC |
Architecture, engineering, and construction |
| AfDB |
African Development Bank |
| AFNOR |
Association Francaise de Normalization |
| AGV |
Automatic guided vehicle |
| AI |
Artificial intelligence |
| AIAG |
Automotive Industry Action Group |
| AICPA |
American Institute of Certified Public Accountants |
| AIMS |
Automated inspection & Measurement systems |
| AIPM |
Australian Institute of Project Management |
| AIS |
Adhesive interconnect system |
| AL |
Arab League |
| ALADI |
Latin American Integration Association |
| ALAP |
As Late As Possible (flexible constraint in Microsoft Project) |
| ALE |
Assembly line equipment |
| AM |
Automatic module (FCM Philips machines) |
| AMF |
American Manufacturing Facility (N. Amer. Factory/Region) |
| AML |
Approved manufacturing list |
| AMU |
Arab Maghreb Union |
| ANOVA |
Analysis of variance |
| ANSI |
American National Standards Institute |
| ANZUS |
Australia-New Zealand-United States Security Treaty |
| AOA |
Activity on Arrow |
| AOI |
Automatic optical inspection |
| AOL |
America on line |
| AON |
Activity on Node |
| AOP |
Annual operational plan |
| AOQ |
Average outgoing quality |
| APCC |
Asia Pacific Customer Center (Penang) |
| APEC |
Asia-Pacific Economic Co-operation |
| APICS |
American production and inventory control system |
| APR |
Asian Pacific Region |
| APS |
Advanced Planning System |
| APT |
Automatically programmed tools |
| AQC |
Acceptance quality control |
| AQL |
Acceptable quality level |
| AQS |
Assembly quality system |
| AR |
Action require or All risks |
| ARPA |
Advanced Research Projects Agency |
| AS |
After sight |
| ASAP |
As soon as possible |
| ASCII |
American Standard Code for Information Interchange |
| ASEAN |
Association of South-East Asian Nations |
| ASIC |
Application specific integrated circuit |
| ASL |
Approved supplier list |
| ASM |
American Society for Metals |
| ASME |
American Society of Mechanical Engineers |
| ASP |
Automatic stencil printer or Association of Shareware Professionals |
| ASQC |
American Society for Quality Control |
| ASTM |
American Society for Testing Materials |
| AT |
Advanced technology |
| at. % |
Atomic percent |
| ATE |
Automatic test equipment |
| ATG |
Automatic test generation |
| atm |
Atmospheres |
| ATP |
Advanced technology program or Available to promise |
| ATS |
Automatic test system |
| AUDI |
Accelerates Under Demonic Influence |
| AUDI |
Always Unsafe Designs Implemented |
| AVL |
Approved vendor listing |
| AVL |
Approved vendor list |
| AWB |
Air way bill |
| AWG |
American Wire Gauge |
| AXI |
Automatic X-ray inspection |
| BABT |
British approval board for telecommunications |
| BAC |
Budget at Completion |
| BATS |
Basic assurance tests |
| BBRAM |
Battery backup random access memory |
| BC |
Business center |
| BCC |
Blind carbon copy |
| BCD |
Best Can Do |
| BCP |
Business continuity plan |
| BCP |
B.o.M. Change Proposal |
| BCWP |
Budgeted Cost of Work Performed (EVA term) |
| BCWS |
Budgeted Cost of Work Scheduled (EVA term) |
| BD |
Breakdown |
| BDX |
Bordeaux (France) |
| BEC |
Basic electronic components |
| Benelux |
Benelux Economic Union |
| BER |
Bit error rate |
| BGA |
Ball grid array |
| BI |
Barcode identification (FCM Philips machines) |
| BIA |
Business impact analysis |
| BID |
Business Initiative Directions |
| BIOS |
Basic input output system |
| BIS |
Bank for International Settlements |
| BIST |
Built in self-test |
| BIT |
Binary digit (value = 1 or 0, on or off) |
| BIT |
Built in test |
| BL |
Back load |
| BLEU |
Belgo-Luxembourg Economic Union |
| BM |
Bad mark |
| BMS |
Bad mark sensing (FCM Philips machines) |
| BMV |
Board vision module (FCM Philips machines) |
| BMW |
Beautiful Mechanical Wonder |
| BMW |
Big Money Works |
| BMW |
Bought My Wife |
| BMW |
Brutal Money Waster |
| BO |
Business Objects |
| BOD |
Biochemical oxygen demand |
| BOM |
Bill of material |
| BPO |
Business process owner |
| BPP |
Basic productive process – reduction on tariff for parts and assemblies |
| BPS |
Best practice sharing |
| BQFP |
Bumper quad flat pack |
| BRA |
Basic Rate Acces |
| BS |
Boundary scan |
| BSB |
Backstreet boys |
| BSI |
British standards institute (ISO 9000 Certifier) |
| BTAB |
Bumped tape-automated bonding |
| BTO |
Build to order |
| BTTE |
Built-in test equipment |
| BTU |
British thermal unit |
| BTW |
By The Way |
| BUICK |
Big Ugly Indestructable Car Killer |
| Burn-in |
Thermal chamber that heats and cools boards to detect latent failures |
| Byte |
String of 8 bits (generally defines a keyboard character) |
| C & F |
Cost and freight |
| C & I |
Cost, insurance |
| C & I |
Commission and interest |
| C / A |
Corrective action |
| C / C |
Communication center |
| C / D |
Cash against documents |
| C4 |
Controlled collapse chip connect |
| CACM |
Central American Common Market |
| CAD |
Computer-aided (assisted) design or Cash against documents |
| CADDIE |
Program that receives and catalogues customer CAD data |
| CAE |
Computer-assisted engineering or Certificate in Advanced English |
| CAFM |
Computer-aided facilities management |
| CAGE |
Commercial and government entity |
| CAGR |
Compounded annual growth rate |
| CALS |
Computer-aided acquisition and logistic support |
| CAM |
Computer-aided (assisted) Manufacturing |
| CAN |
Controller area network (on DeK machine) |
| CAO |
Chief Administrative Officer |
| CAPP |
Computer-aided process planning |
| Caps Lock |
Capital letters lock |
| CAR |
Corrective action request or Capital approval request or Corrective action report |
| CARICOM |
Caribbean Community and Common Market |
| CASE |
Computer-aided software engineering |
| CAT |
Computer-aided testing |
| CBA |
Circuit board assembly |
| CBC&E |
Code of Business Conduct & Ethics |
| CBD |
Cash before delivery |
| CBGA |
Ceramic ball grid array |
| CBP |
CIM Bridge project (FCM Philips machine) |
| CC |
Carbon copy |
| CCA |
Circuit card assembly |
| CCAPS |
Circuit card assembly and processing system |
| CCB |
Change Control Board |
| CCC |
Command call center or China Customer Center (Dell China Factory/Region) |
| CCD |
Charge coupled device |
| CCE |
Customer contact employee |
| CCG |
Customer Configuration Groups (Common management of part numbers) |
| CCGA |
Ceramic column grid array |
| CCIMF |
Communication centre intermediate file – text file (on Fuji machines) |
| CCNA |
Cisco Certified Network Associate |
| CCNM |
Customer commodity and N.P.I. Management |
| CCRP |
Customer complaint resolution process |
| CD |
Can Do |
| CDA |
Confidential disclosure agreement |
| CDQ |
Customer Quality Data |
| CDRH |
Centre for Devices and Radiological Health |
| CD-ROM |
Compact disk – read-only memory |
| CDT |
Corporate deployment team |
| CEAO |
West African Economic Community |
| CEEAC |
Economic Community of Central African States |
| CEFTA |
Central European Free Trade Agreement (originally Visegrad Three) |
| CEO |
Chief executive officer |
| CEPGL |
Economic Community of the Great Lakes Countries |
| CFC |
Chloro Fluoro Carbons |
| cfh |
Cubic feet per hour |
| cfm |
Cubic feet per minute |
| CFM |
Continuous flow manufacturing |
| CFT |
Customer focus team or Centre for Manufacturing Technology |
| CFT |
Cross-Functional Team |
| CGA |
Column grid array |
| CH. PPD. |
Charges prepaid |
| CHEVROLET |
Can Hear Every Valve Rap On Long Extended Trips |
| CHEVROLET |
Cheap, Hardly Efficient, Virtually Runs On Luck Every Time |
| CHIP |
Ceramic capacitors or resistors |
| CI |
Cost, insurance |
| CIA |
Cash in advance |
| CIC |
Condensation inert curing |
| CIF |
Cost, insurance, freight |
| CIH |
Condensation inert heating |
| CILSS |
Permanent Inter-State Committee on Drought Control in the Sahei |
| CIM |
Computer integrated manufacturing |
| CIS |
Condensation inert soldering |
| CIS |
Commonwealth of Independent States |
| CKDB |
Component knowledge database |
| CLC |
Closed loop calibration (FCM Philips machines) |
| CLCA |
Closed loop corrective action |
| CLCC |
Ceramic leaded chi carrier |
| CLCP |
Closed loop corrective action |
| CLIP |
Confirmed line item performance |
| CLM |
Compact laser modules (FCM Philips machines) |
| CLS |
Celestica (Solectron’s competitor) |
| CM |
Contract manufacturers |
| CMA |
Circuit mil area |
| CMC |
Capacity management committee |
| CMD |
Circuit mode data |
| CMO |
Chief Materials Officer |
| CMOS |
Complimentary metal oxide semiconductor |
| CNC |
Computer numerical control |
| CND |
Conform non-defect |
| CO |
Change order |
| COA |
Cost of acquisition |
| COB |
Card on board or Chip on board |
| COC |
Certificate of Compliance |
| COCOM |
Co-ordinating Committee for Multilateral Export Controls |
| COD |
Consumed oxygen demand or Cash on delivery |
| COE |
Center of excellence |
| COF |
Chip on flex |
| COG |
Center of gravity (S.I.M.S.) |
| COGS |
Cost of goods sold |
| COM |
Computer output to microfilm |
| CON |
Configuration file (on FCM Philips machines) |
| COO |
Country of origin |
| COO |
Chief Operating Officer |
| COS |
Cash on shipment |
| CP |
Process capability index or Chip placement |
| CPA |
Critical Path Analysis |
| CPBGA |
Cavity plastic ball grid array |
| CPC |
Customer Project Code |
| CPCN |
Cost procurement |
| CPE |
Certificate of Proficiency in English |
| CPFF |
Cost Plus Fixed Fee |
| CPI |
Continuous process improvement |
| CPI |
Cost Performance Index (EVA term) |
| CPIF |
Cost Plus Incentive Fee |
| CpK |
Adjusted process capability index (Capability performance) |
| CPL |
Capability performance – lower |
| CPM |
Customer program manager |
| CPM |
Critical Path Method |
| CPN |
Customer part number |
| CPU |
Central processing unit |
| CQFP |
Ceramic quad flat pack |
| CQM |
Center of Quality Management |
| CR |
Carriage Return |
| CRF |
Component request form |
| CRM |
Customer Relationship Management |
| CRR |
Customer reject return |
| CRT |
Cathode ray tube |
| CS |
Customer service |
| CS |
Control site |
| CSA |
Customer satisfaction assessment or Canada standards Assn. |
| CSCE |
Conference on Security and Co-operation in Europe |
| CSCM |
Customer supply chain management |
| CSD |
Committed ship date |
| CSE |
Customer support engineer |
| CSI |
Customer satisfaction index |
| CSM |
Customer satisfaction management |
| CSP |
Chip scale package |
| CSS |
Canadian safety standard |
| CTB |
Clear to build |
| CTE |
Coefficient of thermal expansion |
| CTEC |
Certified Technical Education Center |
| CTF |
Critical to function |
| CTO |
Configure to order |
| CTP |
Composite theoretical performance (used for export compliance) |
| CTR |
Cycle time reduction |
| CV |
Cost Variance (EVA term) |
| CVR |
Colour Variance Request |
| CVT |
Component verification and tracking |
| CWK |
Chan Wah KONG |
| CWO |
Cash with order |
| D |
Diameter |
| D / A |
Documents against acceptance, documents attached |
| D / D |
Draft on demand |
| D / P |
Documents against payment |
| DAC |
Digital to analog converter |
| DARM |
Defect analysis & reduction methods |
| DAT |
Digital audio tape |
| dB |
Decibel |
| DBC |
Direct bonded copper |
| DBR |
Daily business review |
| DC |
Document control or DFA / BMS controller (FCM Philips machines) |
| DCA |
Direct chip attach or Daily corrective action |
| DCE |
Dicloroethylene |
| DCF |
Discounted Cash Flow |
| DCP |
Dynamic Control Plan (Dimensional Control Plan) |
| DCT |
Digital cordless telephone |
| DD |
Data Date |
| DDE |
Dynamic data exchange |
| DDU |
Delivery duty unpaid |
| DECT |
Digital enhanced cordless telephone |
| DEF |
DEMANDE D’ESSAI EN FABRICATION (PHILIPS) |
| DEK |
DirEKt imaging |
| DEM |
Dynamic enterprise modeler |
| DFA |
Dynamic fiducial alignment (FCM Philips machines) |
| DFM |
Design for manufacturability |
| DFMA |
Design for manufacturability and assembly |
| DFMEA |
Design Failure Mode and Effects Analysis |
| DFT |
Design for testability |
| DFX |
Design for whatever |
| DHL |
(Adrian) Dalsey, (Larry) Hillblom, and (Robert) Lynn (courier company) or Deliver Halfway Lost |
| diam |
Diameter |
| DIL |
Dual inline |
| DIN |
Deutsches Institut fur Normung (Worldwide level 2 connector) |
| DIP |
Dual inline package |
| DISCRETE |
A passive analog component, i.e. capacitor, resistor, inductor or diode |
| DLL |
Dynamic link library |
| DMA |
Direct memory access |
| DMD |
Data management and documentation (Solectron Germany) |
| DMR |
Defective material reject |
| DNC |
Direct numerical control |
| DOC |
Department for communications |
| DOD |
Department of Defense |
| DODGE |
Drips Oil, Drops Grease Everywhere |
| DOE |
Design of experiments |
| DOR |
Dropped on request |
| DOS |
Days of supply or Disk operating system |
| DPM |
Defects per million |
| DPMO |
Defects per million opportunities |
| DPPM |
Defective parts per million |
| DPU |
Defects per unit |
| DRAM |
Dynamic random access memory |
| DRC |
Design rule checking |
| DRRP |
Disaster response and recovery plan |
| DSC |
Debt Service Coverage |
| DSI |
Days of saleable inventory |
| DSM |
Dynamic setup management |
| DSO |
Days sales outstanding |
| DSP |
Digital signal processor |
| DSR |
Digital storage and retrieval |
| DT |
Demand de travaille (Wavecom) |
| DT |
Deutsche Telecom |
| DTM |
Digital torque meter |
| DTS |
Dock to stock |
| DU |
Duration |
| DUT |
Device under test |
| DVD |
Digital video disk or digital versatile disk |
| DVM |
Digital voltmeter |
| DVP&R |
Design Verification Plan and Report |
| DVR |
Destination Variance Request |
| DVT |
Design verification test |
| E & OE |
Errors and omissions excepted |
| E and O |
Excess and Obsolete |
| EAC |
Estimate at Completion |
| EAN |
European article numbering |
| EBOM |
Engineering bill of material |
| EBRD |
European Bank for Reconstruction and Development |
| EC |
Engineering change |
| ECA |
Economic Commission for Africa |
| ECAD |
Electronic computer-aided design |
| ECAR |
External corrective action request |
| ECAT |
Electronic card assembly and test (acronym used by and for I.B.M. P.C.B.) |
| ECC |
Engineering Change Control or Employee Communication Committee |
| ECCB |
Electronic Component Certification Board |
| ECCN |
Export compliance control number |
| ECE |
Economic Commission for Europe |
| ECF |
Engineering Change File |
| ECL |
Emitter coupled logic |
| ECLAC |
Economic Commission for Latin America and the Caribbean |
| ECN |
Engineering change notice |
| ECO |
Engineering change order |
| ECOWAS |
Economic Community of West African States |
| ECR |
Engineering change request |
| ECU |
Environmental control unit (M.P.M.) |
| EDA |
Electronic design automation |
| EDC |
Engineering date code |
| EDC |
Eau de cologne |
| EDF |
Electronic design interchange format |
| EDFI |
Error detection and fault isolation capability of product |
| EDI |
Electronic data exchange for placing P.O.s and forecasting |
| EDM |
Engineering data management |
| EDP |
Eau de perfume |
| EDT |
Eau de toilette |
| EEA |
European Economic Area |
| EEPROM |
Electronically erasable programmable read-only memory |
| EET |
Earliest Event Time |
| EFD |
Earliest Finish Date |
| EFR |
External Failure Rate |
| EFT |
Earliest Finish Time |
| EFTA |
European Free Trade Association |
| EH&S |
Environmental health and safety |
| EIA |
Electronic industries association |
| EIAJ |
Electronics Industry Association in Japan |
| EIB |
European Investment Bank |
| EIS |
Engineering information system |
| ELA |
Entry Level Automatic |
| ELO |
Enabling learning objective (on FCM Philips machines) |
| EMC |
Electromagnetic compatibility |
| EMF |
Electromotive force or European Manufacturing Facility (for DELL (Limeric, Ireland)) |
| EMI |
Electromagnetic interference |
| EMO |
Emergency Off |
| EMP |
Electromagnetic pulse |
| EMPF |
Electronics Manufacturing Productivity Facility |
| EMPI |
Electronic manufacturing process instruction |
| EMS |
Environmental Management System |
| EMT |
Electronic manufacturing technology |
| EOD |
End of data |
| EOE |
End of effective, work center implementation commit date |
| EOF |
End of file |
| EOL |
End of life |
| EOS |
Employee opinion survey |
| EP&J |
Electronic packaging & joining |
| EPA |
Environmental protection agency |
| EPB |
Emergency Push Button |
| EPD |
Electrical proximity detector (FCM Philips machines) |
| EPK |
Econopak |
| EPP |
Employee preparedness program |
| EPROM |
Erasable programmable read only memory |
| EPST |
Earliest Possible Start Time |
| ERP |
Enterprise requirements plan |
| ERS |
Engineering requirements specification |
| ESA |
European Space Agency |
| ESCAP |
Economic and Social Commission for Asia and the Pacific |
| ESCWA |
Economic and Social Commission for Western Asia |
| ESD |
Electrostatic discharge |
| ESD |
Earliest Start Date |
| ESI |
Employee satisfaction Index or Early Supplier Involvement |
| ESPP |
Employee Stock Purchase Program |
| ESR |
Engineering shift report |
| ESS |
Environmental stress screening (thermal or physical) – all parts testing. |
| EST |
Environmental stress test – sample test |
| EST |
Earliest Start Time |
| ETC |
Estimate To Complete |
| EU |
European Union |
| EVA |
Earned Value Analysis |
| EVT |
Engineering verification test |
| F / N |
Fichier neutre (term is used on Sagem account) |
| F / T |
Functional test |
| F4G |
Fuji fourth generation |
| FA |
Failure analysis or Fixed asset |
| FAA |
Federal Aviation Administration |
| FAC |
Forced air convection |
| FAI |
First article inspection |
| FAIL |
Fixed asset in leasing |
| FAQ |
Frequently asked questions or Free alongside quay |
| FAR |
Failure analysis report |
| FAS |
Free alongside ship |
| FATF |
File allocation table file or Fabmaster ASCII transfer format |
| FC & S |
Free of capture and seizure |
| FCC |
Federal Communications Commissions (U.S.A.) |
| FCE |
First Certificate in English |
| FCM |
Fast component mounter |
| FCM II |
Fast component mounter mark II |
| FCS |
First customer ship |
| FCT |
Functional card test or Flip chip technology |
| FCU |
Furnace Control Unit |
| FDA |
Federal drug and alcohol commission |
| FEA |
Finite element analysis |
| FED |
Field emission displays |
| FEM |
Finite element modeling |
| FET |
Field effect transistor |
| FF |
Finish-To-Finish (type of task relationship in Microsoft Project) |
| FF |
Free Float |
| FFA |
Fixed fiducial alignment (FCM Philips machines) |
| FGI |
Finished goods inventory |
| FH |
Fixture head |
| FHM |
For him magazine |
| FIAT |
Failure in Italian Automotive Technology |
| FIAT |
Fix It All the Time |
| FIAT |
Fix it again, Tony! |
| FIFO |
First in – first out |
| FILO |
First in – last out |
| FIP |
Fuji interlaced placer or Fiche d’instruction de post (Sagem) |
| FIS |
Factory information system |
| FLEX |
Flextronics (Solectron’s competitor) |
| FLS |
Front Line State |
| FLSA |
Fair labor standard act |
| FLT |
Full liquidus temperature |
| FMA |
Failure Mode Analysis |
| FMEA |
Failure mode and effects analysis |
| FMI |
Foreign Machine Interface (DeK machine) |
| FNET |
Finish No Earlier Than (semi-flexible constraint in Microsoft Project) |
| FNLT |
Finish No Later Than (semi-flexible constraint in Microsoft Project) |
| FOB |
Free on board |
| FOP |
Fineness of print (stencil) |
| FORD |
Fix or repair daily |
| FORD |
First On Recall Day |
| FORD |
First On Rust and Deterioration |
| FORD |
Found On Road, Dead |
| FORD |
Fault Of R&D |
| FORD |
Fast Only Rolling Downhill |
| FORD |
Features O.J. and Ron’s DNA |
| FOV |
Field of vision |
| FOW |
Free on waggon |
| FP |
Fine pitch |
| FP |
Factory Planner |
| FPBGA |
Fine pitch ball grid array |
| FPF |
First pass fail |
| FPGA |
Field programmable gate array |
| FPP |
First pass pass |
| FPT |
Flying Probe Tester OR Fine pitch technology |
| FQ |
Fine theta (on CP6 Fuji machines) |
| FQP |
Fuji compact placer |
| FR |
Failure rate |
| FRU |
Field replaceable unit |
| FRY |
For your reference |
| FS |
Finish-To-Start (type of task relationship in Microsoft Project) |
| FT |
Functional test |
| FTC |
First Time Capability |
| FTIR |
Fourier transform infrared spectroscopy |
| FTP |
File transfer protocol |
| FVS |
Functional Verification (Test) |
| FVT |
Functional verification test |
| FYE |
For your education |
| FYI |
For your information |
| FZ |
Franc Zone |
| G / A |
General Average |
| G / L |
General ledger |
| G-3 |
Group of Three |
| G-7 |
Group of Seven |
| G-8 |
Group of Eight |
| GA |
General availability |
| GAAP |
Generally accepted accounting principles |
| GaAs |
Gallium arsenide |
| GALI |
Global American Language Institute |
| GAM |
Global account manager |
| GAP |
General administrative procedure |
| GASC |
Global Account Supply Chain |
| GBP |
Great Britain pound |
| GCC |
Gulf Co-operation Council |
| GDF |
Generic data file |
| GEM |
Generic Equipment Model |
| GenCAD |
Generic CAD format (on FCM Philips machines) |
| Geplacea |
Group of Latin American and Caribbean Sugar Exporting Countries |
| GERT |
Graphical Evaluation and Review Technique |
| GIF |
Graphics interchange format |
| GIGO |
Garbage input garbage output |
| GM |
General manager |
| GM |
General Maintenance |
| GMC |
Garage Man’s Companion |
| GMC |
Got A Mechanic Coming? |
| GPA |
Graphics port accelerator |
| GPA |
Grade Point Average |
| GPA |
Gas Processors Association |
| GPA |
Gas Producers Association |
| GPA |
Gay Pilots Association |
| GPA |
General Partitioning Algorithm |
| GPA |
General Purpose Analysis |
| GPA |
Geophysical Altimeter |
| GPA |
Georgia Association of Planetariums |
| GPA |
Gigapascal |
| GPA |
Government Property Administrator |
| GPA |
Governmental and Public Affairs |
| GPA |
Graphics Performance Accelerator |
| GPA |
Green Point Average |
| GPA |
Guidance Platform Assembly |
| GPM |
General purpose module (FCM Philips machines) |
| GPRS |
General Packet Radio Service |
| GPS |
General power supply or Global positioning system |
| GR&R |
Gage Repeatability & Reproducibility |
| GSBU |
Global Services Business Unit |
| GSM |
Global System for Mobile Communications |
| GSP |
Generalized system of preferences (trade agreement) |
| GUI |
Graphical user interface |
| GWS |
Gabriel Wilhelm Sohlberg |
| H / L |
Handload |
| H / P |
Handphone |
| HAL |
Hot air leveling |
| HALT |
Highly accelerated lifetime test |
| HAP |
Heated Air Plenum |
| HASL |
Hot air solder levelling – raw P.W.B. surface finish |
| HASS |
High acceleration stress screening |
| HCB |
High complexity board |
| HCFC |
Hydro Chloro Fluoro Carbons |
| HDTV |
High-density television |
| HFC |
Hydro Fluoro Carbons |
| HFE |
Hydro Fluoro Ethers |
| HMU |
Hot muck-up |
| HMV |
Hot Mock-up Verification (Test) |
| HONDA |
Had One Never Did Again |
| HOSHIN |
Top-down objective tracking (C.E.O. through sites) |
| HP |
Hewlett Packard |
| HPU |
Hours per unit |
| HR |
Human resources |
| HS |
Health & Safety |
| HT |
Handy terminal (Fuji machines) |
| HTS Code |
Harmonized traffic system |
| HVSD |
High-volume systems division |
| HYUNDAI |
Hope You Understand Nothing’s Driveable And Inexpensive… |
| I – NUB |
Increase netable unit build |
| I / O |
Input / Output |
| I/O |
Input/output |
| IALF |
Item action log form |
| IAW |
In accordance with |
| IBEC |
International Bank for Economic Co-operation |
| IBM |
International business machines |
| IBP |
Initial business process |
| IBRD |
International Bank for Reconstruction and Development |
| IC |
Integrated circuit |
| ICAM |
Integrated computer-aided manufacturing |
| ICAR |
Internal corrective action request |
| ICB |
International Competence Baseline |
| ICC |
International competence center |
| ICC |
International Chamber of Commerce |
| ICEA |
Insulated Cable Engineers Association |
| ICFTU |
International Confederation of Free Trade Unions |
| ICM |
Interface control module (on Q.P.242 Fuji machines) |
| ICO |
Islamic Conference Organization |
| ICP |
Internal control program |
| ICR |
Internal change revision |
| ICSI |
Internal customer satisfaction index |
| ICT |
In-circuit test or Integrated circuit test |
| ID |
Inner diameter |
| IDB |
Inter-American Development Bank |
| IDC |
Insulation displacement connector (contacts pierce conductor insulation) |
| IDL |
Incremental dirt level |
| IDM |
Indirect material |
| IEC |
International Electrotechnical Commission |
| IECQ |
International Electronic Component Qualification System |
| IEEE |
Institute of Electrical and Electronic Engineers |
| IEPS |
International Electronic Packaging Society |
| IFB |
Invitation for Bid |
| IFIR |
Initial field incident rate |
| IGADD |
Inter-Government Authority on Drought and Development |
| IL |
Integration line |
| ILB |
Inner lead bonding |
| ILS |
Integrated Logistic Support |
| IM |
Ingram Micro (Solectron’s competitor) |
| IMAC |
Install, move, add, change |
| IMC |
Intermetallic compound |
| IMF |
International Monetary Fund |
| IMF |
Industrial Mission Formation |
| InGaAs |
Indium Gallium Arsenide detector |
| IOC |
Indian Ocean Commission |
| IORS |
Individual overtime record sheet |
| IPC |
Institute for interconnecting and packaging electronic circuits |
| ipm |
Inches per minute |
| IPMA |
International Project Management Association |
| IPO |
Interactive process optimization |
| IQA |
Incoming quality assurance |
| IQC |
In-coming quality check |
| IR |
Infrared |
| IRDs |
Integrated receivers and decoders |
| IRSI |
Intelligent Reasoning Systems Inc. |
| IS |
Information systems |
| ISA |
Instrument Society of America |
| ISDN |
Integrated services digital network |
| ISF |
Intelligent stick feeder |
| ISHM |
International Society for Hybrid Microelectronics |
| ISO |
International standards organization |
| ISP |
Internet Service Provider or Internet Service Purveyor |
| ISST |
Information services, systems and technology |
| IST |
In-situation stress test |
| IT |
Information technology |
| ITF |
Intelligent tape feeder |
| ITR |
Inbound Traffic Responsible |
| ITSS |
Information technology & systems services |
| JBL |
Jabil Circuit (Solectron’s competitor) |
| JD |
Job description |
| JEDEC |
Joint Electronic Device Engineering Council |
| JFK |
John Fitzgerald Kennedy |
| JIT |
Just in time |
| JOT |
Just on time |
| JP(E)G |
Joint photographic experts group |
| JTAG |
Joint Test Action Group |
| KGB |
Known good board |
| KGD |
Known good die |
| KITA |
Kick in the ass |
| KLT |
Kheng Loon TAN (K.L. TAN) |
| KO |
Knock out |
| KPA |
Key personal analyze |
| L / C |
Letter of credit |
| LA |
Laser align (FCM Philips machines) |
| LAM |
Laser align module (FCM Philips machines) |
| LAN |
Local area network |
| LAR |
Lot acceptance rate |
| LAS |
Laser align system (FCM Philips machines) |
| LC |
Labor cost |
| LCB |
Low complexity board |
| LCBC |
Lake Chad Basin Commission |
| LCC |
Leadless chip carrier |
| LCCC |
Leaded ceramic chip carrier |
| LCD |
Liquid crystal display |
| LCL |
Lower control limit |
| LCSOC |
Leadless chip socket |
| LED |
Light emitting diode |
| LEO |
Lands exposed only |
| LEP |
Leading edge procurement |
| LET |
Latest Event Time |
| LFA |
Logical Framework Approach |
| LFD |
Latest Finish Date |
| LFMA |
Light flexible mechanical assembly |
| LFT |
Latest Finish Time |
| LGA |
Land grid array |
| LID |
Leadless inverted device |
| LIF |
Low insertion force |
| LIFO |
Last in – first out |
| LLCC |
Leadless ceramic chip carrier |
| LLL |
Laser lead locator (on Fuji machines) |
| LMS |
Le Mans |
| LN |
Deutsche Luft und Raumfahrt Norm |
| LOA |
Letter of authorization |
| LP |
Low productivity |
| LPST |
Last Possible Start Time |
| LR |
Labor revenue |
| LRC |
Line Readiness Checklist (F-09-0024) |
| LRP |
Long range plan |
| LSD |
Latest Start Date |
| LSI |
Large scale integration |
| LSL |
Lower specification limit |
| LST |
Latest Start Time |
| LT |
Lead time |
| LTB |
Last time buy |
| LVHM |
Low volume high mix |
| M / C |
Machine (in Fuji manuals) |
| MAP |
Manufacturing automation protocol |
| MAZDA |
Most Always Zipping Dangerously Along |
| MBA |
Master business administration |
| MBB |
Moisture barrier bag |
| MBNQA |
Malcolm Baldrige National Quality Award |
| MC |
Mission critical |
| MCAD |
Mechanical computer-aided design |
| MCAE |
Mechanical computer-aided engineering |
| MCB |
Medium complexity board |
| MCDBA |
Microsoft Certified Database Administrator |
| MCM |
Multichip module |
| MCM-C |
Multi-chip module ceramic |
| MCM-D |
Multi-chip module deposited |
| MCM-L |
Multi-chip module laminate |
| MCN |
Manufacturing Change Note |
| MCOS |
Material cost of sales |
| MCP |
Microsoft Certified Professional |
| MCR |
Master control relay |
| MCS |
Machine control system (on Fuji machines) |
| MCSD |
Microsoft Certified Solutions Developer |
| MCSE |
Microsoft Certified Systems Engineer |
| MCT |
Manufacturing cycle time or Microsoft Certified Trainer |
| MDA |
Manufacturing defect analyzer |
| MDB |
Microsoft database |
| MDF |
Manufacturing data format (on FCM Philips machines) |
| MDF |
Main Distribution Frame |
| MDF |
Macro-Defect-Free |
| MDF |
Macular Degeneration Foundation |
| MDF |
Main Data Feed |
| MDF |
Main Distribution Frequency |
| MDF |
Main Distribution(al) Facility |
| MDF |
Manic Depression Fellowship (UK) |
| MDF |
Manipulator Development Facility |
| MDF |
Manual Dial Facility |
| MDF |
Maritime Defense Force |
| MDF |
Marketing Development Funds |
| MDF |
Mason Dixon Farms, Inc. (Gettysburg, Pennsylvania) |
| MDF |
Master Data File |
| MDF |
Material Discrepancy Form |
| MDF |
Materiel Distribution Forecasting |
| MDF |
Medium Density Fiber |
| MDF |
Medium Density Fibreboard |
| MDF |
Mendelsohn Difference Family |
| MDF |
Mild Detonating Fuse |
| MDF |
Mission Data Folders |
| MDF |
Monitor Definition File |
| MDF |
Morte Di Fame (Italian: Dying of Hunger) |
| MDF |
Mule Deer Foundation |
| MDF |
Multiband Direction Finder |
| MDF |
Multisensor Data Fusion |
| MDI |
Multi-document interface (on Fuji machines) |
| MDS |
Mechanical deflection system |
| ME |
Manufacturing engineer or Mechanical engineer or Mission essential |
| MEA |
Monoethanol amine |
| MELF |
Metalized electrode faced transistor |
| MES |
Manufacturing execution system (floor control systems) |
| MFO |
Must Finish On (inflexible constraint in Microsoft Project) |
| MFU |
Multi feeder unit |
| MIL |
Military |
| miniBGA |
Mini ball grid array |
| MINT |
Motion INTerpreter |
| MIR |
Moisture insulation resistance |
| MIS |
Manufacturing information systems |
| MIS |
Manufacturing information system (FCM Philips machines) |
| MLB |
Multi-layer board |
| MLM |
Multi-layer metal |
| MLPWB |
Multilayer printed wiring board |
| MMI |
Man Machine Interface |
| MNR |
Multiple network resistor |
| MO |
Money order |
| MOC |
Microsoft Oficial Curriculum |
| MODAPTS |
MODular Arrangement of Predetermined Time Standards |
| MOL |
Maintenance on line |
| MOL |
Mac on Linux |
| MOL |
Machine Oriented Language |
| MOL |
Manned Orbital Laboratory |
| MOL |
Märkisch-Oderland (region in East Germany) |
| MOL |
Maximum Order Limitations |
| MOL |
Maximum Ordering Limit |
| MOL |
Maximum Output Level |
| MOL |
Method of Layers |
| MOL |
Minimum Operating Level |
| MOL |
Molde, Norway – Aro (Airport Code) |
| MOL |
Mole |
| MOL |
More Or Less |
| MOP |
Method Of Potentials |
| MOS |
Metal oxide semiconductor |
| MOSFET |
Metal-oxide semiconductor field effect transistor |
| MOUS |
Microsoft Office User Specialist |
| MPE |
Manufacturing project engineer or Manufacturing product engineer |
| MPEG |
Moving pictures expert group |
| MPG |
Machine program generator |
| MPI |
Manufacturing process instruction |
| MPM |
Manufacturing printing machine |
| MPN |
Manufacturer part number |
| MPP |
Manufacturing production plan |
| MPRE |
Manufacturing product engineer |
| MPS |
Material planning system or Master production schedule |
| MPX |
Multiplex channel (on Q.P.242 Fuji machine) |
| MQS |
Material quotation system |
| MR |
Magneto resistive |
| MRB |
Material review board |
| MRO |
Maintenance, repair, operation |
| MRP |
Material requirements planning |
| MS |
Material shortage |
| MSCC |
Material supply chain cost |
| MSCM |
Material supply chain manager |
| MSD |
Moisture sensitive device |
| MSI |
Medium-scale integration (up to 1000 transistors) |
| MSL |
Moisture sensitive level |
| MSO |
Must Start On (inflexible constraint in Microsoft Project) |
| MSRP |
Modelling simulation and rapid prototyping |
| MTBF |
Mean time before failure or Mean time between failure |
| MTOPS |
Millions of theoretical operations per second |
| MTTF |
Mean time to failure |
| MTTR |
Mean time to repair |
| MTU |
Multi tray unit |
| MTX |
Mobile Telephone eXchange |
| MUP |
Multi-user pipette (FCM Philips machines) |
| MVC |
Most vulnerable component |
| MVI |
Manual visual inspection |
| N / A |
Not applicable |
| N / C |
Numerical control |
| NACC |
North Atlantic Co-operation Council |
| NADCAP |
National Aerospace and Defense Contractors Accreditation Procedures |
| NAFTA |
North American Free Trade Agreement |
| NAM |
Non-aligned Movement |
| NASA |
National Aeronautics and Space Administration |
| NAT |
Nozzle arrangement table (Fuji machines) |
| NATO |
North Atlantic Treaty Organization |
| NAY |
Not available yet |
| NBS |
National Bureau of Standards |
| NC |
Nozzle changer (on Fuji machines) |
| NCB |
National Competence Baseline |
| NCM |
Non-conforming material |
| NCT |
Nozzle center test |
| NDF |
No defect found |
| NDT |
Non-destructive testing |
| NEL |
NatSteel (Solectron’s competitor) |
| NEMA |
National Electrical Manufactures Association |
| NEMI |
National Electronics Manufacturing Initiative |
| NFF |
No Fault Found |
| NFPA |
National Fire Protection Association |
| NG |
No good (on S.M.T. Fuji machines) |
| NIBBLE |
String of 4 bits = ½ BYTE |
| NIC |
Network interface card |
| NIS |
National Institute of Standards |
| NIST |
National Fire Protection Association |
| nMOS |
n-Type Metal oxide silicon |
| NMR |
Normal mode rejection |
| NORD |
NO Reference Designator |
| nPB |
n-Propyl bromide |
| NPI |
New products introduction |
| NPN |
Non-intelligent part number |
| NPV |
Net Present Value |
| NRA |
No receivable area |
| NRE |
Non-recurring expense or Non-recoverable error |
| NSC |
National service center |
| NTAI |
Nam Tai (Solectron’s competitor) |
| NWS |
Non-Working Sample |
| O / E |
Optoelectronics |
| OA |
Organic activated |
| OAP |
Order acceptance procedure |
| OAPEC |
Organization of Arab Petroleum Exporting Countries |
| OAS |
Organization of American States |
| OAU |
Organization of African Unity |
| OBS |
Organizational Breakdown Structure |
| OCAP |
Out-of-control action plan |
| OD |
Outer diameter |
| ODBC |
Open database connectivity |
| ODM |
Original design manufacture or Ozone depleting materials |
| ODP |
Ozone depletion potential |
| OECD |
Organization for Economic Co-operation and Development |
| OECS |
Organization of Eastern Caribbean States |
| OEIC |
Optical electronic integrated circuit detector |
| OEM |
Original equipment manufacturer |
| OEMS |
Order Entry Management System |
| OIC |
Organization of the Islamic Conference |
| OJT |
On job training |
| OLB |
Outer lead bonding |
| OLDSMOBILE |
Old Ladies Driving Slowly Make Others Behind Infuriatingly Late Every day. |
| OLDSMOBILE |
Overpriced, Leisurely Driven Sedan Made Of Buick’s Irregular Leftover Equipment |
| OLK |
Outlook |
| OMPAC |
Over molded pad array carrier |
| OMVG |
Gambia River Development Organization |
| OMVS |
Senegal River Development Organization |
| OOB |
Out of box |
| OOBA |
Out of box audit |
| OOC |
Out of control |
| OODA |
Observe, orient, decide, act – C.F.T. process |
| OOO |
Out of order |
| OP |
Operational |
| OPC |
Operational production center |
| OPEC |
Organization of Petroleum Exporting Countries |
| OQI |
Outgoing Quality Inspection |
| OR |
Owner’s risk |
| ORT |
On-going reliability test |
| OSD |
On-screen digital |
| OSF |
Opened Society Foundation |
| OSHA |
Occupational Safety and Health Administration |
| OSN |
Out-of-specification notice |
| OT |
Over time or Overtravel |
| OTD |
On-time delivery |
| OTP |
One time programmable |
| P & L |
Profit and loss |
| P / A |
Preventive action |
| P / I |
Packaging and interconnection |
| PAC |
Pad array carrier or PLAN D’ACTIONS CORRECTIVES (Philips terminology) |
| PAO |
Pickup auto offset (Q.P.242 Fuji machines) |
| Parlacen |
Central American Parliament |
| PAT |
Profit after taxes |
| PB |
Project Buyer |
| PBC |
Plated and bonded copper or PHILIPS business class |
| PBET |
Performance-Based Equipment Training |
| PBGA |
Plastic ball grid array |
| PBOM |
Planning bill of material or Production bill of material |
| PBS |
Product Breakdown Structure |
| PBT |
Profit before taxes |
| PC |
Production control or Personal computer |
| PC |
Percent Complete |
| PCA |
Printed circuit assembly |
| PCB |
Printed circuit board |
| PCBA |
Printed circuit board assembly |
| PCC |
Philips Consumer Communication |
| PCDIU |
Personal Computer Display Input Unit |
| PCE |
Per chloro ethylene |
| PCI |
Peripheral component interconnect or Prime customer interface |
| PCMCIA |
Personal Computer Memory Card International Association |
| PCO |
Production change order (Sagem) |
| PCO |
Production Control Operator |
| PCR |
Production change request |
| PCT |
Planned Completion Time |
| PD |
Part data or Paid |
| PDCA |
Process Deployment Common Activities |
| PDCA |
Plan, Do, Check, Act |
| PDCA |
Please don’t change anything (:-)) |
| PDF |
Portable document format |
| PDM |
Production data management or Patient Monitoring Division |
| PDM |
Precedence Diagramming Method |
| PE |
Project engineer or Product engineer |
| PEM |
Plastic encapsulated microcircuits or Preventive equipment maintenance |
| PERT |
Program Evaluation and Review Technique |
| PET |
Preliminary English Test |
| PET |
Planned End Time |
| PF |
Process functional |
| PF&D |
Personal, Fatigue & Delay |
| PFC |
Per Fluoro Carbons |
| PFMEA |
Process Failure Mode and Effects Analysis |
| PFO |
Profit for operations |
| PFU |
Power feeder unit (on Q.P.132 Fuji machine) |
| PGA |
Pin grid array |
| PI |
Physical inventory |
| PIC |
Passive Improvement Contract |
| PIM |
Parts information manager (on FCM Philips machines) |
| PIP |
Pick and placement module (FCM Philips machines) |
| PIR |
Pilot run (Philips terminology) |
| PLC |
Programmable logic controller |
| PLCC |
Plastic leaded chip carrier |
| PLM |
Placing module (on Q.P. Fuji machines) |
| PLSOC |
Plastic leaded socket |
| PLXS |
Plexus (Solectron’s competitor) |
| PM |
Project manager or Placing module (on FCM Philips machines) |
| PM |
Programme Manager or Project Management |
| PMBOK |
Project Management Body Of Knowledge |
| PMC |
Placing module controller (on Q.P. Fuji machines) |
| PMI |
Process manufacturing instruction |
| PMI |
Project Management Institute |
| PMO |
Program management office |
| PMP |
Process manufacturing plan (Compaq) |
| PMP |
Project Management Professional |
| PN |
Part number |
| PnP |
Plug and Play |
| PO |
Purchase order |
| POC |
Process, organization, culture. |
| POD |
Payment on delivery |
| POI |
Parallel optical interconnects |
| POR |
Purchase Order Request |
| POST – IR |
POST – infrared |
| POTW |
Publicly owned-treatment works |
| POV |
Partition of variation |
| PPA / SI |
Post-pack audit / Source inspection |
| PPB |
Basic productive process (see BPP for English translation) |
| PPC |
Placing pressure control (on Fuji placement machines) |
| PPD |
Prepaid |
| PPM |
Parts per million |
| PPPN |
Per person, per night |
| PPS |
Production preparation software or Production preparation system (FCM Philips machines) |
| PPS – Pro |
Production preparation software – professional version (FCM Philips machines) |
| ppt |
Parts per trillion |
| PPU |
Placement phi unit (FCM Philips machines) |
| PPV |
Purchase price variance |
| PQ |
Pre theta (on CP6 Fuji machines) |
| PQE |
Product quality engineer |
| PQIS |
Procurement quality plan |
| PQP |
Process quality plan (internal) |
| PQP |
Product Quality Planning |
| PQPT |
Product Quality Planning Team |
| PR |
Pilot run |
| PRE – IR |
Pre – infrared |
| PROM |
Programmable read-only memory |
| PRT |
Product realization team |
| PRU |
Prix revient unitaire |
| PSA |
Pressure sensitive adhesive |
| PSD |
Particle-size distribution |
| PSI |
Part-specific information (on FCM Philips machines) |
| psia |
Pounds per square inch absolute |
| psig |
Gauge pressure in pounds per square inch (pressure relative to ambient pressure) |
| PSO |
Preliminary sales order |
| PST |
Planned Start Time |
| PSTN |
Public Switched Telephone Network |
| PTA |
Preferential Trade Area for Eastern and Southern African States |
| PTH |
Pin through hole |
| PTPS |
Parker Team Player Survey |
| PTY |
ProTotYpe |
| PVT |
Pilot verification trial |
| PWA |
Printed wiring assembly |
| PWB |
Printed wired board |
| QA |
Quality assurance |
| QAF |
Quality Alert Form |
| QAS |
Quality assessment schedule |
| QBE |
Query by example |
| QBR |
Quarterly business review |
| QC |
Quality Control |
| QCC |
Quality control cosmetic (on DeTeWe line) |
| QFD |
Quality Function Deployment |
| QFP |
Quad flat pack |
| QIP |
Quality improvement process |
| QIS |
Quality improvement skills |
| QIT |
Quality improvement training |
| QMS |
Quality management system |
| QOH |
Quantity on hand |
| QP |
Quality partners or Quality placement |
| QPI |
Quality productivity improvement |
| QPL |
Qualified products list |
| QSR |
Quality system report |
| QSR |
Quality System Requirements |
| QTY |
Quantity |
| QUBA |
Qualification build assembly |
| R & O |
Risk and opportunity |
| R & S |
Rhode & Schwartz |
| R / O |
Read-only |
| R / W |
Read/write |
| RA |
Rosin-activated |
| RAFA |
Repair after final assembly (on Sagem line) |
| RAI |
Repair after integration (on DeTeWe line) |
| RAM |
Random access memory |
| RAM |
Responsibility Assignment Matrix |
| RAMBUS |
Re Access Memory Bus (memory) |
| RAS |
Reliability, availability, serviceability of a product |
| RBS |
Resource Breakdown Structure |
| RCA |
Root cause analysis |
| RCD |
Row Customer Demand |
| RCE |
Region center Europe |
| RCO |
Rolling changeover (FCM Philips machines) |
| RDI |
Real Dead Item |
| RDU |
Remaining Duration |
| RDY |
Ready |
| REA |
Request for engineering action |
| RegPM |
Registered Project Management |
| REM |
Rapid Eye Movement |
| REV |
Solectron controlled revision (of Customer part number) |
| RF |
Radiofrequency |
| RFI |
Radio frequency interference |
| RFP |
Ready for purchase |
| RFP |
Request For Proposal |
| RFQ |
Request for quote |
| RFq |
Reverse fine theta |
| RFQ |
Request For Quotation |
| RFT |
Right First Time |
| RGB |
Red Green Blue |
| RH |
Relative humidity |
| RISC |
Reduced instruction set chip |
| RLR |
Received loudness ratio (on Final test equipment) |
| RMA |
Returned material authorization or Rosin mildly activated |
| RNIS |
Réseau Numerique (à ) Integration (de) Services [French for ISDN] |
| ROA |
Return on assets (facilities, equipment, cash) |
| ROM |
Read-only memory |
| ROT |
Reflow of through-hole |
| RP |
Request to purchase or Replay paid |
| rpm |
Revolutions per minute |
| RPN |
Risk priority number |
| RPT |
Raw process time |
| RRD |
Returns and reported deficiencies |
| RS |
Remote site |
| RSA |
Rosin super activated |
| RSL |
Recommended supplier list |
| RSSI |
Receiving strength signal indicator |
| RTG |
Resistance To Ground |
| RTN |
Rattle noise |
| RTS |
Return to supplier or Ready to ship |
| RTV |
Returned to vendor |
| SA |
Synthetic-activated |
| SA0 |
Stock at 0 |
| SA1 |
Stock at 1 |
| SAAB |
Send Another Automobile Back |
| SAAB |
Swedish Automobiles Always Breakdown. |
| SAARC |
South Asian Association for Regional Co-operation |
| SADC |
Southern African Development Community |
| SANM |
Sanmina (Solectron’s competitor) |
| SAP |
Systems applications products (in data processing) |
| SARS |
Severe Acute Respiratory Syndrome |
| SBC |
Solder ball connect |
| SBE |
Supplier based engineering |
| SBIP |
Single board image processor (FCM Philips machines) |
| SBM |
Supply base management or Systems based management |
| SCAR |
Supplier correction action request |
| scfh |
Standard cubic feet per hour |
| SCI |
SCI Systems (Solectron’s competitor) |
| SCIM |
Small computer interface module |
| SCP |
Single-chip package |
| SCR |
Silicon controlled rectifiers |
| SCS |
Setup control system (FCM Philips machines) |
| SCSI |
Small computer system interface |
| SCU |
Servo control unit or Sub-controller unit (on Fuji machines) |
| SDC |
Solectron design center |
| SDE |
Scope Definition Element |
| SDE |
Secure Data Exchange |
| SDE |
Shared Data Environment |
| SDE |
Signal Display Editor |
| SDE |
Signal Distribution Equipment |
| SDE |
Simple Delay Equalization (Hekimian) |
| SDE |
Simulated During Exercise |
| SDE |
Software Demonstration Evaluation |
| SDE |
Software Design Engineer |
| SDE |
Software Development Engineer |
| SDE |
Software Development Environment |
| SDE |
Spatial Database Engine |
| SDE |
Standard Data Element |
| SDE |
Statistical Design of Experiments |
| SDE |
Stochastic Differential Equation |
| SDE |
Submission and Delivery Entity (ITU-T) |
| SDE |
Support Data Extension |
| SDE |
Susquehanna Diversified Engineering |
| SDE |
System Development Environment |
| SDE |
Supplier Development Engineer |
| SDWT |
Self-directed work team |
| SE & O |
Sauf erreurs et omissions |
| SEC |
Securities exchange commission |
| SECS |
Semiconductor equipment communications standard |
| SECS II |
Semiconductor equipment communications standard – Part II (FCM Philips machines) |
| SELA |
Latin American Economic System |
| SEM |
Scanning electron microscope |
| SF |
Start-To-Finish (type of task relationship in Microsoft Project) |
| SFAI |
Supplier’s first article inspection |
| SFC |
Shop floor control |
| SFDM |
Shop Floor Data Management |
| SFI |
Shopfloor implementation |
| SFMEA |
System Failure Mode and Effects Analysis |
| SG&A |
Sales General & Admin |
| SI |
Systeme International d’Unites |
| SIA |
Semiconductor industry association |
| SIC |
Station instruction card or Standard industry classification |
| SIMM |
Single in-line memory module |
| SIMS |
Solectron integrated manufacturing system |
| SIP |
Single in-line package |
| SIPOC |
Supplier, Input, Process, Output, Customer |
| SIR |
Surface insulation resistance |
| SITD |
System integration and test division |
| SITEQ |
Solectron integrated tracking environment for Quality |
| SLICC |
Slightly larger than integrated circuit carrier |
| SLM |
Supply line management |
| SLR |
SOLECTRON (symbol on New York stock exchange) or Send loudness ratio (on Final test equipment) |
| SMA |
Surface mount assembly |
| SMART |
Save money, action, resources and time. |
| SMC |
Surface mount component |
| SMD |
Surface mount device |
| SME |
Subject matter expert |
| SMEMA |
Surface Mount Equipment Manufacturers Association |
| SMILE |
Translates customer data into Pick and place data for S.M.T. line |
| SMOBC |
Solder mask over bare copper |
| SMT |
Surface mount technology |
| SMTA |
Surface Mount Technology Association |
| SMV |
Standard Medium Variance |
| SN |
Serial number |
| SNET |
Start No Earlier Than (semi-flexible constraint in Microsoft Project) |
| SNLT |
Start No Later Than (semi-flexible constraint in Microsoft Project) |
| SO |
Small outline |
| SOD |
Small outline diode |
| SOIC |
Small outline integrated circuit |
| SOJ |
Small outline I.C. with J leads |
| SOL |
Small outline large (body) |
| SOP |
Small outline package |
| SOP |
Standard Operation Plan |
| SOS |
Small outline specials or Save Our Souls |
| SOT |
Small outline transistor |
| SOW |
Small outline wide (body) |
| SOW |
Statement Of Work |
| SP |
Service pack (on FCM Philips machines) |
| SPC |
Statistical Process Control |
| SPC |
South Pacific Commission |
| SPD |
Shipment per person per day or Sales per direct |
| SPE |
Lithium-ion solid polymer electrodes (batteries) |
| SPF |
South Pacific Forum |
| SPI |
Schedule Performance Index (EVA term) |
| SPN |
Solectron part number |
| SPQL |
Shipped product quality level |
| SPRS |
Single-pass reflow soldering |
| SQACAR |
Supplier quality assurance corrective action request |
| SQC |
Statistical quality control |
| SQE |
Supplier quality engineer |
| SQL |
Structured query language |
| SQM |
Solectron quality manual |
| SQP |
Statistical quality process |
| SQT |
Structured query tool |
| SRAM |
Static random access memory |
| SS |
Start-To-Start (type of task relationship in Microsoft Project) |
| SSD |
Solid solder deposition |
| SSG |
Systems and services group |
| SSI |
Small-scale integration (up to 100 transistors) |
| SSOP |
Shrink small outline package |
| SSR |
Standard setup report or Station shift report |
| SST |
Silicon Storage Technology |
| STARS |
Shopfloor tracking and reporting system |
| STB |
Still To Build |
| STC |
Solectron technical center |
| STQEA |
Solectron Total Quality Excellence Award |
| STU |
Single tray unit (on Q.P. Fuji machines) |
| SV |
Schedule Variance (EVA term) |
| SVGA |
Super video graphics adapter |
| SVS |
Synthetic vision system (used for defect detection) |
| SWOT |
Strengths, Weaknesses, Opportunities, Threats |
| SWP |
Standard work procedure |
| T |
Temperature |
| TAB |
Tape automated bonding |
| TAM |
Total available market or Telephone answering machine |
| TBC |
To be checked or To be confirmed |
| TBD |
To be defined or To be determined |
| TBF |
Twin bulb feeder (on FCM Philips machines) or To be fired |
| TBGA |
Tape ball grid array or Thermal ball grid array. |
| TBH |
To be hired |
| TBR |
To be replaced |
| TBU |
To be updated |
| Tbulk |
Twin bulk (on FCM Philips machines) |
| TC |
Transport controller (FCM Philips machines) |
| TCC |
Temperature coefficient of capacitance |
| TCE |
Thermal coefficient of expansion or Trichloroethane |
| TCN |
Temporary change notice or Telefono cordless numerico |
| TCO |
Total cost of ownership or Temporary change order |
| TCP |
Tape carrier package (is another name for TAB) or Transmission control protocol |
| TCP / IP |
Transmission control protocol / Internet protocol |
| TCR |
Temperature coefficient of resistance |
| TCS |
Total customer satisfaction |
| TCU |
Temperature Control Unit |
| TDMA |
Time division multiplies access |
| TDO |
Table of denial orders |
| TDR |
Time demand reflect (days of material in hub, goal = 10) |
| TE |
Test Engineer |
| TEU |
Toolbit exchange unit |
| TF |
Total Float |
| TGA |
Thermogravimetric analyzer |
| TGIF |
Thank God is Friday |
| TGR |
Things Gone Right |
| TGW |
Things Gone Wrong |
| TH |
Tooling hole |
| THD |
Third harmonic distortion |
| THT |
Through-hole technology |
| TIB |
Temporary import in bond (Trade agreement) |
| TIG |
Technology implementation group |
| TIM |
Test, inspection and measurement |
| TLO |
Terminal learning objective (on FCM Philips machines) or Total loss only |
| TOS |
Type of Service |
| TOYOTA |
Too Often Yankees Overprice This Auto |
| TPE |
Transfer Project Engineer |
| TPI |
Test process instruction |
| TPM |
Technical project manager |
| TPM |
Technical Production Meeting |
| TPR |
Technique de Plastic Roumaine |
| TPS |
Toyota Production System |
| TPT |
Total process time |
| TPU |
Tape pack unit (on Fuji machines) |
| TQ |
Tel quel = tale quale = just as the goods |
| TQC |
Total quality control |
| TQFP |
Thin quad flat pack |
| TQM |
Total quality management |
| TRR |
Trial run request |
| TRRPL |
Trial run request in production line |
| TRS |
Turbo Reflow Solder |
| TSB |
Target share of business (with suppliers) |
| TSBU |
Technology solutions business unit |
| TSCPA |
Tennessee Society of Certified Public Accountants |
| TSCR |
Temporary Sagem change request |
| TSOP |
Thin small outline package |
| TSSOP |
Thin shrink small outline package |
| TTL |
Transistor-to-transistor logic |
| TTL |
Time To Live |
| TU |
Touch up |
| TUV |
Technisher uberwachungs verein |
| TWG |
Technology working group |
| UC |
Unit cost |
| UCL |
Upper control limit |
| UDEAC |
Central African Customs and Economic Union |
| UDMA |
Ultra direct memory access |
| UES |
User Earth Station |
| UFPT |
Ultra fine pitch technology |
| UL |
Underwriters Laboratory |
| ULSI |
Ultra large-scale integration (exceeds 1 million transistors) |
| UMC |
Unit manufacturing cost |
| UN |
United Nations |
| UPS |
Uninterruptible Power Supply or United Parcel Service (transport company) |
| URL |
Uniform Resource Locator |
| USA |
United States of America |
| USI |
Unscheduled issues |
| USL |
Upper specification limit |
| USR |
U.S. Robotics |
| UUT |
Unit under test |
| V |
Volt |
| VAC |
Variance at Completion |
| VAR |
Value added reseller |
| VAT |
Value added tax |
| VBA |
Visual basic for applications |
| VBE |
Visual Basic editor |
| VCD |
Various center distance |
| VDE |
German / European safety standards |
| VDR |
Verify defect repair |
| VDU |
Video Display Unit |
| VE/VA |
Value Engineering/Value Analysis |
| VER |
Solectron assigned unique 2 digit version code |
| VG |
Verteidigungasgerte Norm |
| VGA |
Video graphics adapter |
| VH1 |
Video hits 1 |
| VI |
Visual inspection |
| VIAFA |
Visual inspection after Final assembly |
| VIAM |
Visual inspection after milling |
| VIAMI |
Visual inspection after Manual insertion |
| VIAR |
Visual inspection after reflow |
| VIBR |
Visual inspection before reflow |
| VIFIR |
Dell field returns |
| VLRR |
Verified Line Reject Rate (Dell line fallout returns) |
| VLSI |
Very large-scale integrated circuits (up to 1 million transistors) or Very large scale integration |
| VMI |
Vendor managed inventory |
| VMS |
Volatile methyl-siloxanes |
| VOC |
Volatile organic compound |
| vol |
Volume |
| VOLVO |
Very Odd-Looking Vehicular Object |
| VPS |
Vapor phase soldering |
| VR |
Voltage regulator |
| VRAM |
Video random access memory |
| VRM |
Voltage regulator module (controls voltage into processor)* |
| VSPA |
Very small peripheral array |
| VTU |
View & Touch up. |
| VUE |
Virtual University Enterprises |
| VW |
Virtually Worthless |
| W |
Watt |
| W / B |
Way bill |
| W / O |
Work order |
| W / W |
Warehouse warrant |
| WA |
With average |
| WAC |
Weighted average cost |
| WAN |
Wide area network |
| WAP |
Wireless Application Protocol |
| WB |
Waybill |
| WBR |
Weekly business review |
| WBR |
With Best Regards |
| WBS |
Work breakdown structure |
| WC |
Work cell or Water closet |
| WEU |
Western European Union |
| WG |
Weight guaranteed |
| WH |
Warehouse |
| WHO |
World Health Organization |
| WI |
Wettability index |
| WIIFM |
What’s in it for me (PPS Pro manual – for Philips machines) |
| WIP |
Work in progress |
| WMD |
Weller multi digital |
| WORD |
Word size of a given computer (8 bits or 18 bits, or 32 bits etc.) |
| WPA |
With particular average |
| WPM |
Wide placement module (FCM Philips machines) |
| WRAM |
Windows random access memory |
| WTC |
World Trade Center |
| WVM |
Wide vision module (FCM Philips machines) |
| WW |
World wide |
| WWMS |
Worldwide materials system |
| WWW |
World wide web |
| WYSIWYG |
What you see is what you get |
| X’fer |
Transfer |
| XPI |
Customer electronic design data for CADDIE |
| Y2K |
The year 2000 |
| ZFT |
Zero-failure throughput |
| ZIF |
Zero insertion force (connector) |
| ZIP |
Zig-zag in-line package (socket) |
