Winlotto – Tatts Lotto Statistics
New!!! – updated statistics for Tatts Lotto.
https://tattslotto-statistics.au/
And we’ll keep them coming. We’ll update stats weekly, for you to enjoy.
Cheers, Nick
New!!! – updated statistics for Tatts Lotto.
https://tattslotto-statistics.au/
And we’ll keep them coming. We’ll update stats weekly, for you to enjoy.
Cheers, Nick
New web based databases posted on Nick’s Software.
For any details contact us at customDB@nicks-software.com
You can get Demos for 60 days to try them on and good deals to buy them after that.
https://nicks-software.com/exp/NS-Training-Management-System.php
https://nicks-software.com/exp/NS-Temperature-Relative-Humidity-Monitoring.php
https://nicks-software.com/exp/NS-Toogle-intranet-search-engine.php
Updated Tatts Lotto statistics for tonight’s Mega Draw:
https://winlotto.nicks-software.com/analiza_Chart_chart.php
plus list of Tatts Lotto Quintets that have been drawn more than once:
No1 | No2 | No3 | No4 | No5 | Drawn | Last Time |
16 | 22 | 35 | 37 | 42 | 2 | 22-10-16 |
1 | 3 | 14 | 24 | 35 | 2 | 07-05-16 |
5 | 27 | 31 | 37 | 42 | 2 | 05-09-15 |
16 | 19 | 20 | 27 | 35 | 2 | 08-11-14 |
11 | 13 | 21 | 42 | 44 | 2 | 11-10-14 |
5 | 7 | 12 | 28 | 40 | 2 | 26-07-14 |
5 | 7 | 20 | 31 | 39 | 2 | 05-07-14 |
7 | 10 | 12 | 28 | 44 | 2 | 09-03-13 |
1 | 17 | 32 | 34 | 45 | 2 | 22-09-12 |
9 | 19 | 24 | 29 | 31 | 2 | 01-09-12 |
9 | 14 | 22 | 31 | 33 | 2 | 21-01-12 |
13 | 18 | 19 | 23 | 28 | 2 | 14-01-12 |
7 | 19 | 28 | 43 | 45 | 2 | 22-10-11 |
10 | 20 | 21 | 25 | 38 | 2 | 10-09-11 |
10 | 20 | 25 | 38 | 39 | 2 | 10-09-11 |
6 | 9 | 27 | 39 | 43 | 2 | 06-08-11 |
4 | 6 | 7 | 31 | 45 | 2 | 30-10-10 |
5 | 11 | 15 | 36 | 42 | 2 | 11-09-10 |
21 | 34 | 39 | 42 | 43 | 2 | 08-05-10 |
4 | 5 | 12 | 18 | 25 | 2 | 24-04-10 |
8 | 13 | 15 | 18 | 29 | 2 | 23-01-10 |
2 | 14 | 16 | 23 | 39 | 2 | 24-10-09 |
5 | 21 | 22 | 25 | 27 | 2 | 28-03-09 |
5 | 20 | 23 | 24 | 26 | 2 | 14-02-09 |
6 | 18 | 30 | 43 | 44 | 2 | 29-11-08 |
27 | 33 | 34 | 38 | 41 | 2 | 08-09-07 |
1 | 7 | 25 | 36 | 41 | 2 | 09-12-06 |
3 | 8 | 9 | 36 | 41 | 2 | 06-11-04 |
3 | 19 | 24 | 35 | 40 | 2 | 07-08-04 |
1 | 8 | 20 | 27 | 36 | 2 | 28-02-04 |
5 | 18 | 22 | 26 | 37 | 2 | 03-01-04 |
3 | 25 | 36 | 43 | 45 | 2 | 31-05-03 |
15 | 16 | 29 | 33 | 34 | 2 | 01-02-03 |
1 | 11 | 37 | 41 | 43 | 2 | 30-11-02 |
3 | 7 | 22 | 35 | 45 | 2 | 07-09-02 |
7 | 17 | 20 | 23 | 42 | 2 | 13-07-02 |
1 | 8 | 22 | 30 | 40 | 2 | 04-05-02 |
26 | 31 | 32 | 36 | 45 | 2 | 30-03-02 |
4 | 7 | 15 | 27 | 43 | 2 | 03-11-01 |
15 | 22 | 25 | 34 | 35 | 2 | 15-09-01 |
12 | 20 | 31 | 33 | 44 | 2 | 11-08-01 |
3 | 4 | 12 | 14 | 20 | 2 | 04-08-01 |
3 | 14 | 22 | 24 | 39 | 2 | 05-02-00 |
4 | 11 | 26 | 29 | 34 | 2 | 11-09-99 |
16 | 18 | 21 | 35 | 38 | 2 | 10-04-99 |
5 | 13 | 25 | 40 | 44 | 2 | 29-08-98 |
4 | 16 | 17 | 27 | 42 | 2 | 14-03-98 |
2 | 11 | 17 | 32 | 40 | 2 | 17-01-98 |
23 | 25 | 36 | 39 | 43 | 2 | 24-05-97 |
7 | 9 | 20 | 28 | 36 | 2 | 05-10-96 |
3 | 5 | 19 | 24 | 40 | 2 | 17-08-96 |
13 | 15 | 26 | 42 | 44 | 2 | 27-04-96 |
4 | 9 | 17 | 21 | 44 | 2 | 13-01-96 |
4 | 15 | 24 | 31 | 42 | 2 | 11-02-95 |
6 | 32 | 34 | 36 | 41 | 2 | 21-01-95 |
3 | 5 | 24 | 25 | 42 | 2 | 20-11-93 |
7 | 14 | 16 | 18 | 29 | 2 | 15-05-93 |
3 | 8 | 10 | 11 | 21 | 2 | 08-08-92 |
5 | 27 | 29 | 31 | 33 | 2 | 16-11-91 |
4 | 5 | 8 | 15 | 28 | 2 | 10-11-90 |
7 | 13 | 14 | 17 | 22 | 2 | 30-06-90 |
3 | 13 | 34 | 37 | 41 | 2 | 04-02-89 |
9 | 20 | 28 | 29 | 32 | 2 | 10-12-88 |
26 | 38 | 41 | 43 | 44 | 2 | 05-03-88 |
4 | 6 | 12 | 25 | 32 | 2 | 23-05-87 |
8 | 18 | 19 | 26 | 29 | 2 | 29-11-86 |
12 | 17 | 19 | 20 | 39 | 2 | 15-06-85 |
9 | 14 | 16 | 18 | 40 | 2 | 21-07-84 |
7 | 8 | 11 | 25 | 33 | 2 | 14-01-84 |
9 | 25 | 32 | 33 | 35 | 2 | 12-06-82 |
2 | 6 | 18 | 19 | 39 | 2 | 24-10-81 |
No sextets have been drawn more than once.
We’ve created a database containing all the abbreviations listed in the table below. Try it:
https://nicks-software.com/abbreviations/
We are updating it regularly, if you want to contribute let us know at:
Abbreviation | Meaning |
---|---|
0 | Angular measure; degree |
0C | Degree Celsius/centigrade |
0F | Degree Fahrenheit |
2DI | Two Dimensional Inspection (on Screen printing machines) |
3D | Three-dimensional |
3DPM | 3 Dimensional Packaging Module |
5 S | Seiri (Organization or sort), Seiton (Orderliness or arrange), Seisou (Cleanliness), Seiketsu (Standardized cleanup), Shitsuke (Discipline) |
A | Ampere |
A / D | After date |
A / I | Automatic insertion |
A / P | Accounts payable |
A / R | Accounts receivable or All risks |
A / S | After sight |
AAGR | Average annual growth rate |
AAR | Against all risks |
ABC | Activity-based costing |
ABP | Active Business Partners |
ABS | Acrylonitrile-butadiene-styrene (plastic) or antiblocking system |
ac | Alternating current |
AC | Alternating current |
ACAR | Audit corrective action request |
ACI | Axial circuit insertion |
ACM | Advanced component mounter (Philips machine) |
ACP | African, Caribbean and Pacific Countries |
ACWP | Actual Cost of Work Performed (EVA term) |
AD | After date |
ADB | Asian Development Bank |
ADL | Allowable dirt level |
ADM | Activity Diagram Method |
ADP | Avis de depannage provisoire |
AEC | African Economic Community |
AEC | Architecture, engineering, and construction |
AfDB | African Development Bank |
AFNOR | Association Francaise de Normalization |
AGV | Automatic guided vehicle |
AI | Artificial intelligence |
AIAG | Automotive Industry Action Group |
AICPA | American Institute of Certified Public Accountants |
AIMS | Automated inspection & Measurement systems |
AIPM | Australian Institute of Project Management |
AIS | Adhesive interconnect system |
AL | Arab League |
ALADI | Latin American Integration Association |
ALAP | As Late As Possible (flexible constraint in Microsoft Project) |
ALE | Assembly line equipment |
AM | Automatic module (FCM Philips machines) |
AMF | American Manufacturing Facility (N. Amer. Factory/Region) |
AML | Approved manufacturing list |
AMU | Arab Maghreb Union |
ANOVA | Analysis of variance |
ANSI | American National Standards Institute |
ANZUS | Australia-New Zealand-United States Security Treaty |
AOA | Activity on Arrow |
AOI | Automatic optical inspection |
AOL | America on line |
AON | Activity on Node |
AOP | Annual operational plan |
AOQ | Average outgoing quality |
APCC | Asia Pacific Customer Center (Penang) |
APEC | Asia-Pacific Economic Co-operation |
APICS | American production and inventory control system |
APR | Asian Pacific Region |
APS | Advanced Planning System |
APT | Automatically programmed tools |
AQC | Acceptance quality control |
AQL | Acceptable quality level |
AQS | Assembly quality system |
AR | Action require or All risks |
ARPA | Advanced Research Projects Agency |
AS | After sight |
ASAP | As soon as possible |
ASCII | American Standard Code for Information Interchange |
ASEAN | Association of South-East Asian Nations |
ASIC | Application specific integrated circuit |
ASL | Approved supplier list |
ASM | American Society for Metals |
ASME | American Society of Mechanical Engineers |
ASP | Automatic stencil printer or Association of Shareware Professionals |
ASQC | American Society for Quality Control |
ASTM | American Society for Testing Materials |
AT | Advanced technology |
at. % | Atomic percent |
ATE | Automatic test equipment |
ATG | Automatic test generation |
atm | Atmospheres |
ATP | Advanced technology program or Available to promise |
ATS | Automatic test system |
AUDI | Accelerates Under Demonic Influence |
AUDI | Always Unsafe Designs Implemented |
AVL | Approved vendor listing |
AVL | Approved vendor list |
AWB | Air way bill |
AWG | American Wire Gauge |
AXI | Automatic X-ray inspection |
BABT | British approval board for telecommunications |
BAC | Budget at Completion |
BATS | Basic assurance tests |
BBRAM | Battery backup random access memory |
BC | Business center |
BCC | Blind carbon copy |
BCD | Best Can Do |
BCP | Business continuity plan |
BCP | B.o.M. Change Proposal |
BCWP | Budgeted Cost of Work Performed (EVA term) |
BCWS | Budgeted Cost of Work Scheduled (EVA term) |
BD | Breakdown |
BDX | Bordeaux (France) |
BEC | Basic electronic components |
Benelux | Benelux Economic Union |
BER | Bit error rate |
BGA | Ball grid array |
BI | Barcode identification (FCM Philips machines) |
BIA | Business impact analysis |
BID | Business Initiative Directions |
BIOS | Basic input output system |
BIS | Bank for International Settlements |
BIST | Built in self-test |
BIT | Binary digit (value = 1 or 0, on or off) |
BIT | Built in test |
BL | Back load |
BLEU | Belgo-Luxembourg Economic Union |
BM | Bad mark |
BMS | Bad mark sensing (FCM Philips machines) |
BMV | Board vision module (FCM Philips machines) |
BMW | Beautiful Mechanical Wonder |
BMW | Big Money Works |
BMW | Bought My Wife |
BMW | Brutal Money Waster |
BO | Business Objects |
BOD | Biochemical oxygen demand |
BOM | Bill of material |
BPO | Business process owner |
BPP | Basic productive process – reduction on tariff for parts and assemblies |
BPS | Best practice sharing |
BQFP | Bumper quad flat pack |
BRA | Basic Rate Acces |
BS | Boundary scan |
BSB | Backstreet boys |
BSI | British standards institute (ISO 9000 Certifier) |
BTAB | Bumped tape-automated bonding |
BTO | Build to order |
BTTE | Built-in test equipment |
BTU | British thermal unit |
BTW | By The Way |
BUICK | Big Ugly Indestructable Car Killer |
Burn-in | Thermal chamber that heats and cools boards to detect latent failures |
Byte | String of 8 bits (generally defines a keyboard character) |
C & F | Cost and freight |
C & I | Cost, insurance |
C & I | Commission and interest |
C / A | Corrective action |
C / C | Communication center |
C / D | Cash against documents |
C4 | Controlled collapse chip connect |
CACM | Central American Common Market |
CAD | Computer-aided (assisted) design or Cash against documents |
CADDIE | Program that receives and catalogues customer CAD data |
CAE | Computer-assisted engineering or Certificate in Advanced English |
CAFM | Computer-aided facilities management |
CAGE | Commercial and government entity |
CAGR | Compounded annual growth rate |
CALS | Computer-aided acquisition and logistic support |
CAM | Computer-aided (assisted) Manufacturing |
CAN | Controller area network (on DeK machine) |
CAO | Chief Administrative Officer |
CAPP | Computer-aided process planning |
Caps Lock | Capital letters lock |
CAR | Corrective action request or Capital approval request or Corrective action report |
CARICOM | Caribbean Community and Common Market |
CASE | Computer-aided software engineering |
CAT | Computer-aided testing |
CBA | Circuit board assembly |
CBC&E | Code of Business Conduct & Ethics |
CBD | Cash before delivery |
CBGA | Ceramic ball grid array |
CBP | CIM Bridge project (FCM Philips machine) |
CC | Carbon copy |
CCA | Circuit card assembly |
CCAPS | Circuit card assembly and processing system |
CCB | Change Control Board |
CCC | Command call center or China Customer Center (Dell China Factory/Region) |
CCD | Charge coupled device |
CCE | Customer contact employee |
CCG | Customer Configuration Groups (Common management of part numbers) |
CCGA | Ceramic column grid array |
CCIMF | Communication centre intermediate file – text file (on Fuji machines) |
CCNA | Cisco Certified Network Associate |
CCNM | Customer commodity and N.P.I. Management |
CCRP | Customer complaint resolution process |
CD | Can Do |
CDA | Confidential disclosure agreement |
CDQ | Customer Quality Data |
CDRH | Centre for Devices and Radiological Health |
CD-ROM | Compact disk – read-only memory |
CDT | Corporate deployment team |
CEAO | West African Economic Community |
CEEAC | Economic Community of Central African States |
CEFTA | Central European Free Trade Agreement (originally Visegrad Three) |
CEO | Chief executive officer |
CEPGL | Economic Community of the Great Lakes Countries |
CFC | Chloro Fluoro Carbons |
cfh | Cubic feet per hour |
cfm | Cubic feet per minute |
CFM | Continuous flow manufacturing |
CFT | Customer focus team or Centre for Manufacturing Technology |
CFT | Cross-Functional Team |
CGA | Column grid array |
CH. PPD. | Charges prepaid |
CHEVROLET | Can Hear Every Valve Rap On Long Extended Trips |
CHEVROLET | Cheap, Hardly Efficient, Virtually Runs On Luck Every Time |
CHIP | Ceramic capacitors or resistors |
CI | Cost, insurance |
CIA | Cash in advance |
CIC | Condensation inert curing |
CIF | Cost, insurance, freight |
CIH | Condensation inert heating |
CILSS | Permanent Inter-State Committee on Drought Control in the Sahei |
CIM | Computer integrated manufacturing |
CIS | Condensation inert soldering |
CIS | Commonwealth of Independent States |
CKDB | Component knowledge database |
CLC | Closed loop calibration (FCM Philips machines) |
CLCA | Closed loop corrective action |
CLCC | Ceramic leaded chi carrier |
CLCP | Closed loop corrective action |
CLIP | Confirmed line item performance |
CLM | Compact laser modules (FCM Philips machines) |
CLS | Celestica (Solectron’s competitor) |
CM | Contract manufacturers |
CMA | Circuit mil area |
CMC | Capacity management committee |
CMD | Circuit mode data |
CMO | Chief Materials Officer |
CMOS | Complimentary metal oxide semiconductor |
CNC | Computer numerical control |
CND | Conform non-defect |
CO | Change order |
COA | Cost of acquisition |
COB | Card on board or Chip on board |
COC | Certificate of Compliance |
COCOM | Co-ordinating Committee for Multilateral Export Controls |
COD | Consumed oxygen demand or Cash on delivery |
COE | Center of excellence |
COF | Chip on flex |
COG | Center of gravity (S.I.M.S.) |
COGS | Cost of goods sold |
COM | Computer output to microfilm |
CON | Configuration file (on FCM Philips machines) |
COO | Country of origin |
COO | Chief Operating Officer |
COS | Cash on shipment |
CP | Process capability index or Chip placement |
CPA | Critical Path Analysis |
CPBGA | Cavity plastic ball grid array |
CPC | Customer Project Code |
CPCN | Cost procurement |
CPE | Certificate of Proficiency in English |
CPFF | Cost Plus Fixed Fee |
CPI | Continuous process improvement |
CPI | Cost Performance Index (EVA term) |
CPIF | Cost Plus Incentive Fee |
CpK | Adjusted process capability index (Capability performance) |
CPL | Capability performance – lower |
CPM | Customer program manager |
CPM | Critical Path Method |
CPN | Customer part number |
CPU | Central processing unit |
CQFP | Ceramic quad flat pack |
CQM | Center of Quality Management |
CR | Carriage Return |
CRF | Component request form |
CRM | Customer Relationship Management |
CRR | Customer reject return |
CRT | Cathode ray tube |
CS | Customer service |
CS | Control site |
CSA | Customer satisfaction assessment or Canada standards Assn. |
CSCE | Conference on Security and Co-operation in Europe |
CSCM | Customer supply chain management |
CSD | Committed ship date |
CSE | Customer support engineer |
CSI | Customer satisfaction index |
CSM | Customer satisfaction management |
CSP | Chip scale package |
CSS | Canadian safety standard |
CTB | Clear to build |
CTE | Coefficient of thermal expansion |
CTEC | Certified Technical Education Center |
CTF | Critical to function |
CTO | Configure to order |
CTP | Composite theoretical performance (used for export compliance) |
CTR | Cycle time reduction |
CV | Cost Variance (EVA term) |
CVR | Colour Variance Request |
CVT | Component verification and tracking |
CWK | Chan Wah KONG |
CWO | Cash with order |
D | Diameter |
D / A | Documents against acceptance, documents attached |
D / D | Draft on demand |
D / P | Documents against payment |
DAC | Digital to analog converter |
DARM | Defect analysis & reduction methods |
DAT | Digital audio tape |
dB | Decibel |
DBC | Direct bonded copper |
DBR | Daily business review |
DC | Document control or DFA / BMS controller (FCM Philips machines) |
DCA | Direct chip attach or Daily corrective action |
DCE | Dicloroethylene |
DCF | Discounted Cash Flow |
DCP | Dynamic Control Plan (Dimensional Control Plan) |
DCT | Digital cordless telephone |
DD | Data Date |
DDE | Dynamic data exchange |
DDU | Delivery duty unpaid |
DECT | Digital enhanced cordless telephone |
DEF | DEMANDE D’ESSAI EN FABRICATION (PHILIPS) |
DEK | DirEKt imaging |
DEM | Dynamic enterprise modeler |
DFA | Dynamic fiducial alignment (FCM Philips machines) |
DFM | Design for manufacturability |
DFMA | Design for manufacturability and assembly |
DFMEA | Design Failure Mode and Effects Analysis |
DFT | Design for testability |
DFX | Design for whatever |
DHL | (Adrian) Dalsey, (Larry) Hillblom, and (Robert) Lynn (courier company) or Deliver Halfway Lost |
diam | Diameter |
DIL | Dual inline |
DIN | Deutsches Institut fur Normung (Worldwide level 2 connector) |
DIP | Dual inline package |
DISCRETE | A passive analog component, i.e. capacitor, resistor, inductor or diode |
DLL | Dynamic link library |
DMA | Direct memory access |
DMD | Data management and documentation (Solectron Germany) |
DMR | Defective material reject |
DNC | Direct numerical control |
DOC | Department for communications |
DOD | Department of Defense |
DODGE | Drips Oil, Drops Grease Everywhere |
DOE | Design of experiments |
DOR | Dropped on request |
DOS | Days of supply or Disk operating system |
DPM | Defects per million |
DPMO | Defects per million opportunities |
DPPM | Defective parts per million |
DPU | Defects per unit |
DRAM | Dynamic random access memory |
DRC | Design rule checking |
DRRP | Disaster response and recovery plan |
DSC | Debt Service Coverage |
DSI | Days of saleable inventory |
DSM | Dynamic setup management |
DSO | Days sales outstanding |
DSP | Digital signal processor |
DSR | Digital storage and retrieval |
DT | Demand de travaille (Wavecom) |
DT | Deutsche Telecom |
DTM | Digital torque meter |
DTS | Dock to stock |
DU | Duration |
DUT | Device under test |
DVD | Digital video disk or digital versatile disk |
DVM | Digital voltmeter |
DVP&R | Design Verification Plan and Report |
DVR | Destination Variance Request |
DVT | Design verification test |
E & OE | Errors and omissions excepted |
E and O | Excess and Obsolete |
EAC | Estimate at Completion |
EAN | European article numbering |
EBOM | Engineering bill of material |
EBRD | European Bank for Reconstruction and Development |
EC | Engineering change |
ECA | Economic Commission for Africa |
ECAD | Electronic computer-aided design |
ECAR | External corrective action request |
ECAT | Electronic card assembly and test (acronym used by and for I.B.M. P.C.B.) |
ECC | Engineering Change Control or Employee Communication Committee |
ECCB | Electronic Component Certification Board |
ECCN | Export compliance control number |
ECE | Economic Commission for Europe |
ECF | Engineering Change File |
ECL | Emitter coupled logic |
ECLAC | Economic Commission for Latin America and the Caribbean |
ECN | Engineering change notice |
ECO | Engineering change order |
ECOWAS | Economic Community of West African States |
ECR | Engineering change request |
ECU | Environmental control unit (M.P.M.) |
EDA | Electronic design automation |
EDC | Engineering date code |
EDC | Eau de cologne |
EDF | Electronic design interchange format |
EDFI | Error detection and fault isolation capability of product |
EDI | Electronic data exchange for placing P.O.s and forecasting |
EDM | Engineering data management |
EDP | Eau de perfume |
EDT | Eau de toilette |
EEA | European Economic Area |
EEPROM | Electronically erasable programmable read-only memory |
EET | Earliest Event Time |
EFD | Earliest Finish Date |
EFR | External Failure Rate |
EFT | Earliest Finish Time |
EFTA | European Free Trade Association |
EH&S | Environmental health and safety |
EIA | Electronic industries association |
EIAJ | Electronics Industry Association in Japan |
EIB | European Investment Bank |
EIS | Engineering information system |
ELA | Entry Level Automatic |
ELO | Enabling learning objective (on FCM Philips machines) |
EMC | Electromagnetic compatibility |
EMF | Electromotive force or European Manufacturing Facility (for DELL (Limeric, Ireland)) |
EMI | Electromagnetic interference |
EMO | Emergency Off |
EMP | Electromagnetic pulse |
EMPF | Electronics Manufacturing Productivity Facility |
EMPI | Electronic manufacturing process instruction |
EMS | Environmental Management System |
EMT | Electronic manufacturing technology |
EOD | End of data |
EOE | End of effective, work center implementation commit date |
EOF | End of file |
EOL | End of life |
EOS | Employee opinion survey |
EP&J | Electronic packaging & joining |
EPA | Environmental protection agency |
EPB | Emergency Push Button |
EPD | Electrical proximity detector (FCM Philips machines) |
EPK | Econopak |
EPP | Employee preparedness program |
EPROM | Erasable programmable read only memory |
EPST | Earliest Possible Start Time |
ERP | Enterprise requirements plan |
ERS | Engineering requirements specification |
ESA | European Space Agency |
ESCAP | Economic and Social Commission for Asia and the Pacific |
ESCWA | Economic and Social Commission for Western Asia |
ESD | Electrostatic discharge |
ESD | Earliest Start Date |
ESI | Employee satisfaction Index or Early Supplier Involvement |
ESPP | Employee Stock Purchase Program |
ESR | Engineering shift report |
ESS | Environmental stress screening (thermal or physical) – all parts testing. |
EST | Environmental stress test – sample test |
EST | Earliest Start Time |
ETC | Estimate To Complete |
EU | European Union |
EVA | Earned Value Analysis |
EVT | Engineering verification test |
F / N | Fichier neutre (term is used on Sagem account) |
F / T | Functional test |
F4G | Fuji fourth generation |
FA | Failure analysis or Fixed asset |
FAA | Federal Aviation Administration |
FAC | Forced air convection |
FAI | First article inspection |
FAIL | Fixed asset in leasing |
FAQ | Frequently asked questions or Free alongside quay |
FAR | Failure analysis report |
FAS | Free alongside ship |
FATF | File allocation table file or Fabmaster ASCII transfer format |
FC & S | Free of capture and seizure |
FCC | Federal Communications Commissions (U.S.A.) |
FCE | First Certificate in English |
FCM | Fast component mounter |
FCM II | Fast component mounter mark II |
FCS | First customer ship |
FCT | Functional card test or Flip chip technology |
FCU | Furnace Control Unit |
FDA | Federal drug and alcohol commission |
FEA | Finite element analysis |
FED | Field emission displays |
FEM | Finite element modeling |
FET | Field effect transistor |
FF | Finish-To-Finish (type of task relationship in Microsoft Project) |
FF | Free Float |
FFA | Fixed fiducial alignment (FCM Philips machines) |
FGI | Finished goods inventory |
FH | Fixture head |
FHM | For him magazine |
FIAT | Failure in Italian Automotive Technology |
FIAT | Fix It All the Time |
FIAT | Fix it again, Tony! |
FIFO | First in – first out |
FILO | First in – last out |
FIP | Fuji interlaced placer or Fiche d’instruction de post (Sagem) |
FIS | Factory information system |
FLEX | Flextronics (Solectron’s competitor) |
FLS | Front Line State |
FLSA | Fair labor standard act |
FLT | Full liquidus temperature |
FMA | Failure Mode Analysis |
FMEA | Failure mode and effects analysis |
FMI | Foreign Machine Interface (DeK machine) |
FNET | Finish No Earlier Than (semi-flexible constraint in Microsoft Project) |
FNLT | Finish No Later Than (semi-flexible constraint in Microsoft Project) |
FOB | Free on board |
FOP | Fineness of print (stencil) |
FORD | Fix or repair daily |
FORD | First On Recall Day |
FORD | First On Rust and Deterioration |
FORD | Found On Road, Dead |
FORD | Fault Of R&D |
FORD | Fast Only Rolling Downhill |
FORD | Features O.J. and Ron’s DNA |
FOV | Field of vision |
FOW | Free on waggon |
FP | Fine pitch |
FP | Factory Planner |
FPBGA | Fine pitch ball grid array |
FPF | First pass fail |
FPGA | Field programmable gate array |
FPP | First pass pass |
FPT | Flying Probe Tester OR Fine pitch technology |
FQ | Fine theta (on CP6 Fuji machines) |
FQP | Fuji compact placer |
FR | Failure rate |
FRU | Field replaceable unit |
FRY | For your reference |
FS | Finish-To-Start (type of task relationship in Microsoft Project) |
FT | Functional test |
FTC | First Time Capability |
FTIR | Fourier transform infrared spectroscopy |
FTP | File transfer protocol |
FVS | Functional Verification (Test) |
FVT | Functional verification test |
FYE | For your education |
FYI | For your information |
FZ | Franc Zone |
G / A | General Average |
G / L | General ledger |
G-3 | Group of Three |
G-7 | Group of Seven |
G-8 | Group of Eight |
GA | General availability |
GAAP | Generally accepted accounting principles |
GaAs | Gallium arsenide |
GALI | Global American Language Institute |
GAM | Global account manager |
GAP | General administrative procedure |
GASC | Global Account Supply Chain |
GBP | Great Britain pound |
GCC | Gulf Co-operation Council |
GDF | Generic data file |
GEM | Generic Equipment Model |
GenCAD | Generic CAD format (on FCM Philips machines) |
Geplacea | Group of Latin American and Caribbean Sugar Exporting Countries |
GERT | Graphical Evaluation and Review Technique |
GIF | Graphics interchange format |
GIGO | Garbage input garbage output |
GM | General manager |
GM | General Maintenance |
GMC | Garage Man’s Companion |
GMC | Got A Mechanic Coming? |
GPA | Graphics port accelerator |
GPA | Grade Point Average |
GPA | Gas Processors Association |
GPA | Gas Producers Association |
GPA | Gay Pilots Association |
GPA | General Partitioning Algorithm |
GPA | General Purpose Analysis |
GPA | Geophysical Altimeter |
GPA | Georgia Association of Planetariums |
GPA | Gigapascal |
GPA | Government Property Administrator |
GPA | Governmental and Public Affairs |
GPA | Graphics Performance Accelerator |
GPA | Green Point Average |
GPA | Guidance Platform Assembly |
GPM | General purpose module (FCM Philips machines) |
GPRS | General Packet Radio Service |
GPS | General power supply or Global positioning system |
GR&R | Gage Repeatability & Reproducibility |
GSBU | Global Services Business Unit |
GSM | Global System for Mobile Communications |
GSP | Generalized system of preferences (trade agreement) |
GUI | Graphical user interface |
GWS | Gabriel Wilhelm Sohlberg |
H / L | Handload |
H / P | Handphone |
HAL | Hot air leveling |
HALT | Highly accelerated lifetime test |
HAP | Heated Air Plenum |
HASL | Hot air solder levelling – raw P.W.B. surface finish |
HASS | High acceleration stress screening |
HCB | High complexity board |
HCFC | Hydro Chloro Fluoro Carbons |
HDTV | High-density television |
HFC | Hydro Fluoro Carbons |
HFE | Hydro Fluoro Ethers |
HMU | Hot muck-up |
HMV | Hot Mock-up Verification (Test) |
HONDA | Had One Never Did Again |
HOSHIN | Top-down objective tracking (C.E.O. through sites) |
HP | Hewlett Packard |
HPU | Hours per unit |
HR | Human resources |
HS | Health & Safety |
HT | Handy terminal (Fuji machines) |
HTS Code | Harmonized traffic system |
HVSD | High-volume systems division |
HYUNDAI | Hope You Understand Nothing’s Driveable And Inexpensive… |
I – NUB | Increase netable unit build |
I / O | Input / Output |
I/O | Input/output |
IALF | Item action log form |
IAW | In accordance with |
IBEC | International Bank for Economic Co-operation |
IBM | International business machines |
IBP | Initial business process |
IBRD | International Bank for Reconstruction and Development |
IC | Integrated circuit |
ICAM | Integrated computer-aided manufacturing |
ICAR | Internal corrective action request |
ICB | International Competence Baseline |
ICC | International competence center |
ICC | International Chamber of Commerce |
ICEA | Insulated Cable Engineers Association |
ICFTU | International Confederation of Free Trade Unions |
ICM | Interface control module (on Q.P.242 Fuji machines) |
ICO | Islamic Conference Organization |
ICP | Internal control program |
ICR | Internal change revision |
ICSI | Internal customer satisfaction index |
ICT | In-circuit test or Integrated circuit test |
ID | Inner diameter |
IDB | Inter-American Development Bank |
IDC | Insulation displacement connector (contacts pierce conductor insulation) |
IDL | Incremental dirt level |
IDM | Indirect material |
IEC | International Electrotechnical Commission |
IECQ | International Electronic Component Qualification System |
IEEE | Institute of Electrical and Electronic Engineers |
IEPS | International Electronic Packaging Society |
IFB | Invitation for Bid |
IFIR | Initial field incident rate |
IGADD | Inter-Government Authority on Drought and Development |
IL | Integration line |
ILB | Inner lead bonding |
ILS | Integrated Logistic Support |
IM | Ingram Micro (Solectron’s competitor) |
IMAC | Install, move, add, change |
IMC | Intermetallic compound |
IMF | International Monetary Fund |
IMF | Industrial Mission Formation |
InGaAs | Indium Gallium Arsenide detector |
IOC | Indian Ocean Commission |
IORS | Individual overtime record sheet |
IPC | Institute for interconnecting and packaging electronic circuits |
ipm | Inches per minute |
IPMA | International Project Management Association |
IPO | Interactive process optimization |
IQA | Incoming quality assurance |
IQC | In-coming quality check |
IR | Infrared |
IRDs | Integrated receivers and decoders |
IRSI | Intelligent Reasoning Systems Inc. |
IS | Information systems |
ISA | Instrument Society of America |
ISDN | Integrated services digital network |
ISF | Intelligent stick feeder |
ISHM | International Society for Hybrid Microelectronics |
ISO | International standards organization |
ISP | Internet Service Provider or Internet Service Purveyor |
ISST | Information services, systems and technology |
IST | In-situation stress test |
IT | Information technology |
ITF | Intelligent tape feeder |
ITR | Inbound Traffic Responsible |
ITSS | Information technology & systems services |
JBL | Jabil Circuit (Solectron’s competitor) |
JD | Job description |
JEDEC | Joint Electronic Device Engineering Council |
JFK | John Fitzgerald Kennedy |
JIT | Just in time |
JOT | Just on time |
JP(E)G | Joint photographic experts group |
JTAG | Joint Test Action Group |
KGB | Known good board |
KGD | Known good die |
KITA | Kick in the ass |
KLT | Kheng Loon TAN (K.L. TAN) |
KO | Knock out |
KPA | Key personal analyze |
L / C | Letter of credit |
LA | Laser align (FCM Philips machines) |
LAM | Laser align module (FCM Philips machines) |
LAN | Local area network |
LAR | Lot acceptance rate |
LAS | Laser align system (FCM Philips machines) |
LC | Labor cost |
LCB | Low complexity board |
LCBC | Lake Chad Basin Commission |
LCC | Leadless chip carrier |
LCCC | Leaded ceramic chip carrier |
LCD | Liquid crystal display |
LCL | Lower control limit |
LCSOC | Leadless chip socket |
LED | Light emitting diode |
LEO | Lands exposed only |
LEP | Leading edge procurement |
LET | Latest Event Time |
LFA | Logical Framework Approach |
LFD | Latest Finish Date |
LFMA | Light flexible mechanical assembly |
LFT | Latest Finish Time |
LGA | Land grid array |
LID | Leadless inverted device |
LIF | Low insertion force |
LIFO | Last in – first out |
LLCC | Leadless ceramic chip carrier |
LLL | Laser lead locator (on Fuji machines) |
LMS | Le Mans |
LN | Deutsche Luft und Raumfahrt Norm |
LOA | Letter of authorization |
LP | Low productivity |
LPST | Last Possible Start Time |
LR | Labor revenue |
LRC | Line Readiness Checklist (F-09-0024) |
LRP | Long range plan |
LSD | Latest Start Date |
LSI | Large scale integration |
LSL | Lower specification limit |
LST | Latest Start Time |
LT | Lead time |
LTB | Last time buy |
LVHM | Low volume high mix |
M / C | Machine (in Fuji manuals) |
MAP | Manufacturing automation protocol |
MAZDA | Most Always Zipping Dangerously Along |
MBA | Master business administration |
MBB | Moisture barrier bag |
MBNQA | Malcolm Baldrige National Quality Award |
MC | Mission critical |
MCAD | Mechanical computer-aided design |
MCAE | Mechanical computer-aided engineering |
MCB | Medium complexity board |
MCDBA | Microsoft Certified Database Administrator |
MCM | Multichip module |
MCM-C | Multi-chip module ceramic |
MCM-D | Multi-chip module deposited |
MCM-L | Multi-chip module laminate |
MCN | Manufacturing Change Note |
MCOS | Material cost of sales |
MCP | Microsoft Certified Professional |
MCR | Master control relay |
MCS | Machine control system (on Fuji machines) |
MCSD | Microsoft Certified Solutions Developer |
MCSE | Microsoft Certified Systems Engineer |
MCT | Manufacturing cycle time or Microsoft Certified Trainer |
MDA | Manufacturing defect analyzer |
MDB | Microsoft database |
MDF | Manufacturing data format (on FCM Philips machines) |
MDF | Main Distribution Frame |
MDF | Macro-Defect-Free |
MDF | Macular Degeneration Foundation |
MDF | Main Data Feed |
MDF | Main Distribution Frequency |
MDF | Main Distribution(al) Facility |
MDF | Manic Depression Fellowship (UK) |
MDF | Manipulator Development Facility |
MDF | Manual Dial Facility |
MDF | Maritime Defense Force |
MDF | Marketing Development Funds |
MDF | Mason Dixon Farms, Inc. (Gettysburg, Pennsylvania) |
MDF | Master Data File |
MDF | Material Discrepancy Form |
MDF | Materiel Distribution Forecasting |
MDF | Medium Density Fiber |
MDF | Medium Density Fibreboard |
MDF | Mendelsohn Difference Family |
MDF | Mild Detonating Fuse |
MDF | Mission Data Folders |
MDF | Monitor Definition File |
MDF | Morte Di Fame (Italian: Dying of Hunger) |
MDF | Mule Deer Foundation |
MDF | Multiband Direction Finder |
MDF | Multisensor Data Fusion |
MDI | Multi-document interface (on Fuji machines) |
MDS | Mechanical deflection system |
ME | Manufacturing engineer or Mechanical engineer or Mission essential |
MEA | Monoethanol amine |
MELF | Metalized electrode faced transistor |
MES | Manufacturing execution system (floor control systems) |
MFO | Must Finish On (inflexible constraint in Microsoft Project) |
MFU | Multi feeder unit |
MIL | Military |
miniBGA | Mini ball grid array |
MINT | Motion INTerpreter |
MIR | Moisture insulation resistance |
MIS | Manufacturing information systems |
MIS | Manufacturing information system (FCM Philips machines) |
MLB | Multi-layer board |
MLM | Multi-layer metal |
MLPWB | Multilayer printed wiring board |
MMI | Man Machine Interface |
MNR | Multiple network resistor |
MO | Money order |
MOC | Microsoft Oficial Curriculum |
MODAPTS | MODular Arrangement of Predetermined Time Standards |
MOL | Maintenance on line |
MOL | Mac on Linux |
MOL | Machine Oriented Language |
MOL | Manned Orbital Laboratory |
MOL | Märkisch-Oderland (region in East Germany) |
MOL | Maximum Order Limitations |
MOL | Maximum Ordering Limit |
MOL | Maximum Output Level |
MOL | Method of Layers |
MOL | Minimum Operating Level |
MOL | Molde, Norway – Aro (Airport Code) |
MOL | Mole |
MOL | More Or Less |
MOP | Method Of Potentials |
MOS | Metal oxide semiconductor |
MOSFET | Metal-oxide semiconductor field effect transistor |
MOUS | Microsoft Office User Specialist |
MPE | Manufacturing project engineer or Manufacturing product engineer |
MPEG | Moving pictures expert group |
MPG | Machine program generator |
MPI | Manufacturing process instruction |
MPM | Manufacturing printing machine |
MPN | Manufacturer part number |
MPP | Manufacturing production plan |
MPRE | Manufacturing product engineer |
MPS | Material planning system or Master production schedule |
MPX | Multiplex channel (on Q.P.242 Fuji machine) |
MQS | Material quotation system |
MR | Magneto resistive |
MRB | Material review board |
MRO | Maintenance, repair, operation |
MRP | Material requirements planning |
MS | Material shortage |
MSCC | Material supply chain cost |
MSCM | Material supply chain manager |
MSD | Moisture sensitive device |
MSI | Medium-scale integration (up to 1000 transistors) |
MSL | Moisture sensitive level |
MSO | Must Start On (inflexible constraint in Microsoft Project) |
MSRP | Modelling simulation and rapid prototyping |
MTBF | Mean time before failure or Mean time between failure |
MTOPS | Millions of theoretical operations per second |
MTTF | Mean time to failure |
MTTR | Mean time to repair |
MTU | Multi tray unit |
MTX | Mobile Telephone eXchange |
MUP | Multi-user pipette (FCM Philips machines) |
MVC | Most vulnerable component |
MVI | Manual visual inspection |
N / A | Not applicable |
N / C | Numerical control |
NACC | North Atlantic Co-operation Council |
NADCAP | National Aerospace and Defense Contractors Accreditation Procedures |
NAFTA | North American Free Trade Agreement |
NAM | Non-aligned Movement |
NASA | National Aeronautics and Space Administration |
NAT | Nozzle arrangement table (Fuji machines) |
NATO | North Atlantic Treaty Organization |
NAY | Not available yet |
NBS | National Bureau of Standards |
NC | Nozzle changer (on Fuji machines) |
NCB | National Competence Baseline |
NCM | Non-conforming material |
NCT | Nozzle center test |
NDF | No defect found |
NDT | Non-destructive testing |
NEL | NatSteel (Solectron’s competitor) |
NEMA | National Electrical Manufactures Association |
NEMI | National Electronics Manufacturing Initiative |
NFF | No Fault Found |
NFPA | National Fire Protection Association |
NG | No good (on S.M.T. Fuji machines) |
NIBBLE | String of 4 bits = ½ BYTE |
NIC | Network interface card |
NIS | National Institute of Standards |
NIST | National Fire Protection Association |
nMOS | n-Type Metal oxide silicon |
NMR | Normal mode rejection |
NORD | NO Reference Designator |
nPB | n-Propyl bromide |
NPI | New products introduction |
NPN | Non-intelligent part number |
NPV | Net Present Value |
NRA | No receivable area |
NRE | Non-recurring expense or Non-recoverable error |
NSC | National service center |
NTAI | Nam Tai (Solectron’s competitor) |
NWS | Non-Working Sample |
O / E | Optoelectronics |
OA | Organic activated |
OAP | Order acceptance procedure |
OAPEC | Organization of Arab Petroleum Exporting Countries |
OAS | Organization of American States |
OAU | Organization of African Unity |
OBS | Organizational Breakdown Structure |
OCAP | Out-of-control action plan |
OD | Outer diameter |
ODBC | Open database connectivity |
ODM | Original design manufacture or Ozone depleting materials |
ODP | Ozone depletion potential |
OECD | Organization for Economic Co-operation and Development |
OECS | Organization of Eastern Caribbean States |
OEIC | Optical electronic integrated circuit detector |
OEM | Original equipment manufacturer |
OEMS | Order Entry Management System |
OIC | Organization of the Islamic Conference |
OJT | On job training |
OLB | Outer lead bonding |
OLDSMOBILE | Old Ladies Driving Slowly Make Others Behind Infuriatingly Late Every day. |
OLDSMOBILE | Overpriced, Leisurely Driven Sedan Made Of Buick’s Irregular Leftover Equipment |
OLK | Outlook |
OMPAC | Over molded pad array carrier |
OMVG | Gambia River Development Organization |
OMVS | Senegal River Development Organization |
OOB | Out of box |
OOBA | Out of box audit |
OOC | Out of control |
OODA | Observe, orient, decide, act – C.F.T. process |
OOO | Out of order |
OP | Operational |
OPC | Operational production center |
OPEC | Organization of Petroleum Exporting Countries |
OQI | Outgoing Quality Inspection |
OR | Owner’s risk |
ORT | On-going reliability test |
OSD | On-screen digital |
OSF | Opened Society Foundation |
OSHA | Occupational Safety and Health Administration |
OSN | Out-of-specification notice |
OT | Over time or Overtravel |
OTD | On-time delivery |
OTP | One time programmable |
P & L | Profit and loss |
P / A | Preventive action |
P / I | Packaging and interconnection |
PAC | Pad array carrier or PLAN D’ACTIONS CORRECTIVES (Philips terminology) |
PAO | Pickup auto offset (Q.P.242 Fuji machines) |
Parlacen | Central American Parliament |
PAT | Profit after taxes |
PB | Project Buyer |
PBC | Plated and bonded copper or PHILIPS business class |
PBET | Performance-Based Equipment Training |
PBGA | Plastic ball grid array |
PBOM | Planning bill of material or Production bill of material |
PBS | Product Breakdown Structure |
PBT | Profit before taxes |
PC | Production control or Personal computer |
PC | Percent Complete |
PCA | Printed circuit assembly |
PCB | Printed circuit board |
PCBA | Printed circuit board assembly |
PCC | Philips Consumer Communication |
PCDIU | Personal Computer Display Input Unit |
PCE | Per chloro ethylene |
PCI | Peripheral component interconnect or Prime customer interface |
PCMCIA | Personal Computer Memory Card International Association |
PCO | Production change order (Sagem) |
PCO | Production Control Operator |
PCR | Production change request |
PCT | Planned Completion Time |
PD | Part data or Paid |
PDCA | Process Deployment Common Activities |
PDCA | Plan, Do, Check, Act |
PDCA | Please don’t change anything (:-)) |
Portable document format | |
PDM | Production data management or Patient Monitoring Division |
PDM | Precedence Diagramming Method |
PE | Project engineer or Product engineer |
PEM | Plastic encapsulated microcircuits or Preventive equipment maintenance |
PERT | Program Evaluation and Review Technique |
PET | Preliminary English Test |
PET | Planned End Time |
PF | Process functional |
PF&D | Personal, Fatigue & Delay |
PFC | Per Fluoro Carbons |
PFMEA | Process Failure Mode and Effects Analysis |
PFO | Profit for operations |
PFU | Power feeder unit (on Q.P.132 Fuji machine) |
PGA | Pin grid array |
PI | Physical inventory |
PIC | Passive Improvement Contract |
PIM | Parts information manager (on FCM Philips machines) |
PIP | Pick and placement module (FCM Philips machines) |
PIR | Pilot run (Philips terminology) |
PLC | Programmable logic controller |
PLCC | Plastic leaded chip carrier |
PLM | Placing module (on Q.P. Fuji machines) |
PLSOC | Plastic leaded socket |
PLXS | Plexus (Solectron’s competitor) |
PM | Project manager or Placing module (on FCM Philips machines) |
PM | Programme Manager or Project Management |
PMBOK | Project Management Body Of Knowledge |
PMC | Placing module controller (on Q.P. Fuji machines) |
PMI | Process manufacturing instruction |
PMI | Project Management Institute |
PMO | Program management office |
PMP | Process manufacturing plan (Compaq) |
PMP | Project Management Professional |
PN | Part number |
PnP | Plug and Play |
PO | Purchase order |
POC | Process, organization, culture. |
POD | Payment on delivery |
POI | Parallel optical interconnects |
POR | Purchase Order Request |
POST – IR | POST – infrared |
POTW | Publicly owned-treatment works |
POV | Partition of variation |
PPA / SI | Post-pack audit / Source inspection |
PPB | Basic productive process (see BPP for English translation) |
PPC | Placing pressure control (on Fuji placement machines) |
PPD | Prepaid |
PPM | Parts per million |
PPPN | Per person, per night |
PPS | Production preparation software or Production preparation system (FCM Philips machines) |
PPS – Pro | Production preparation software – professional version (FCM Philips machines) |
ppt | Parts per trillion |
PPU | Placement phi unit (FCM Philips machines) |
PPV | Purchase price variance |
PQ | Pre theta (on CP6 Fuji machines) |
PQE | Product quality engineer |
PQIS | Procurement quality plan |
PQP | Process quality plan (internal) |
PQP | Product Quality Planning |
PQPT | Product Quality Planning Team |
PR | Pilot run |
PRE – IR | Pre – infrared |
PROM | Programmable read-only memory |
PRT | Product realization team |
PRU | Prix revient unitaire |
PSA | Pressure sensitive adhesive |
PSD | Particle-size distribution |
PSI | Part-specific information (on FCM Philips machines) |
psia | Pounds per square inch absolute |
psig | Gauge pressure in pounds per square inch (pressure relative to ambient pressure) |
PSO | Preliminary sales order |
PST | Planned Start Time |
PSTN | Public Switched Telephone Network |
PTA | Preferential Trade Area for Eastern and Southern African States |
PTH | Pin through hole |
PTPS | Parker Team Player Survey |
PTY | ProTotYpe |
PVT | Pilot verification trial |
PWA | Printed wiring assembly |
PWB | Printed wired board |
QA | Quality assurance |
QAF | Quality Alert Form |
QAS | Quality assessment schedule |
QBE | Query by example |
QBR | Quarterly business review |
QC | Quality Control |
QCC | Quality control cosmetic (on DeTeWe line) |
QFD | Quality Function Deployment |
QFP | Quad flat pack |
QIP | Quality improvement process |
QIS | Quality improvement skills |
QIT | Quality improvement training |
QMS | Quality management system |
QOH | Quantity on hand |
QP | Quality partners or Quality placement |
QPI | Quality productivity improvement |
QPL | Qualified products list |
QSR | Quality system report |
QSR | Quality System Requirements |
QTY | Quantity |
QUBA | Qualification build assembly |
R & O | Risk and opportunity |
R & S | Rhode & Schwartz |
R / O | Read-only |
R / W | Read/write |
RA | Rosin-activated |
RAFA | Repair after final assembly (on Sagem line) |
RAI | Repair after integration (on DeTeWe line) |
RAM | Random access memory |
RAM | Responsibility Assignment Matrix |
RAMBUS | Re Access Memory Bus (memory) |
RAS | Reliability, availability, serviceability of a product |
RBS | Resource Breakdown Structure |
RCA | Root cause analysis |
RCD | Row Customer Demand |
RCE | Region center Europe |
RCO | Rolling changeover (FCM Philips machines) |
RDI | Real Dead Item |
RDU | Remaining Duration |
RDY | Ready |
REA | Request for engineering action |
RegPM | Registered Project Management |
REM | Rapid Eye Movement |
REV | Solectron controlled revision (of Customer part number) |
RF | Radiofrequency |
RFI | Radio frequency interference |
RFP | Ready for purchase |
RFP | Request For Proposal |
RFQ | Request for quote |
RFq | Reverse fine theta |
RFQ | Request For Quotation |
RFT | Right First Time |
RGB | Red Green Blue |
RH | Relative humidity |
RISC | Reduced instruction set chip |
RLR | Received loudness ratio (on Final test equipment) |
RMA | Returned material authorization or Rosin mildly activated |
RNIS | Réseau Numerique (à ) Integration (de) Services [French for ISDN] |
ROA | Return on assets (facilities, equipment, cash) |
ROM | Read-only memory |
ROT | Reflow of through-hole |
RP | Request to purchase or Replay paid |
rpm | Revolutions per minute |
RPN | Risk priority number |
RPT | Raw process time |
RRD | Returns and reported deficiencies |
RS | Remote site |
RSA | Rosin super activated |
RSL | Recommended supplier list |
RSSI | Receiving strength signal indicator |
RTG | Resistance To Ground |
RTN | Rattle noise |
RTS | Return to supplier or Ready to ship |
RTV | Returned to vendor |
SA | Synthetic-activated |
SA0 | Stock at 0 |
SA1 | Stock at 1 |
SAAB | Send Another Automobile Back |
SAAB | Swedish Automobiles Always Breakdown. |
SAARC | South Asian Association for Regional Co-operation |
SADC | Southern African Development Community |
SANM | Sanmina (Solectron’s competitor) |
SAP | Systems applications products (in data processing) |
SARS | Severe Acute Respiratory Syndrome |
SBC | Solder ball connect |
SBE | Supplier based engineering |
SBIP | Single board image processor (FCM Philips machines) |
SBM | Supply base management or Systems based management |
SCAR | Supplier correction action request |
scfh | Standard cubic feet per hour |
SCI | SCI Systems (Solectron’s competitor) |
SCIM | Small computer interface module |
SCP | Single-chip package |
SCR | Silicon controlled rectifiers |
SCS | Setup control system (FCM Philips machines) |
SCSI | Small computer system interface |
SCU | Servo control unit or Sub-controller unit (on Fuji machines) |
SDC | Solectron design center |
SDE | Scope Definition Element |
SDE | Secure Data Exchange |
SDE | Shared Data Environment |
SDE | Signal Display Editor |
SDE | Signal Distribution Equipment |
SDE | Simple Delay Equalization (Hekimian) |
SDE | Simulated During Exercise |
SDE | Software Demonstration Evaluation |
SDE | Software Design Engineer |
SDE | Software Development Engineer |
SDE | Software Development Environment |
SDE | Spatial Database Engine |
SDE | Standard Data Element |
SDE | Statistical Design of Experiments |
SDE | Stochastic Differential Equation |
SDE | Submission and Delivery Entity (ITU-T) |
SDE | Support Data Extension |
SDE | Susquehanna Diversified Engineering |
SDE | System Development Environment |
SDE | Supplier Development Engineer |
SDWT | Self-directed work team |
SE & O | Sauf erreurs et omissions |
SEC | Securities exchange commission |
SECS | Semiconductor equipment communications standard |
SECS II | Semiconductor equipment communications standard – Part II (FCM Philips machines) |
SELA | Latin American Economic System |
SEM | Scanning electron microscope |
SF | Start-To-Finish (type of task relationship in Microsoft Project) |
SFAI | Supplier’s first article inspection |
SFC | Shop floor control |
SFDM | Shop Floor Data Management |
SFI | Shopfloor implementation |
SFMEA | System Failure Mode and Effects Analysis |
SG&A | Sales General & Admin |
SI | Systeme International d’Unites |
SIA | Semiconductor industry association |
SIC | Station instruction card or Standard industry classification |
SIMM | Single in-line memory module |
SIMS | Solectron integrated manufacturing system |
SIP | Single in-line package |
SIPOC | Supplier, Input, Process, Output, Customer |
SIR | Surface insulation resistance |
SITD | System integration and test division |
SITEQ | Solectron integrated tracking environment for Quality |
SLICC | Slightly larger than integrated circuit carrier |
SLM | Supply line management |
SLR | SOLECTRON (symbol on New York stock exchange) or Send loudness ratio (on Final test equipment) |
SMA | Surface mount assembly |
SMART | Save money, action, resources and time. |
SMC | Surface mount component |
SMD | Surface mount device |
SME | Subject matter expert |
SMEMA | Surface Mount Equipment Manufacturers Association |
SMILE | Translates customer data into Pick and place data for S.M.T. line |
SMOBC | Solder mask over bare copper |
SMT | Surface mount technology |
SMTA | Surface Mount Technology Association |
SMV | Standard Medium Variance |
SN | Serial number |
SNET | Start No Earlier Than (semi-flexible constraint in Microsoft Project) |
SNLT | Start No Later Than (semi-flexible constraint in Microsoft Project) |
SO | Small outline |
SOD | Small outline diode |
SOIC | Small outline integrated circuit |
SOJ | Small outline I.C. with J leads |
SOL | Small outline large (body) |
SOP | Small outline package |
SOP | Standard Operation Plan |
SOS | Small outline specials or Save Our Souls |
SOT | Small outline transistor |
SOW | Small outline wide (body) |
SOW | Statement Of Work |
SP | Service pack (on FCM Philips machines) |
SPC | Statistical Process Control |
SPC | South Pacific Commission |
SPD | Shipment per person per day or Sales per direct |
SPE | Lithium-ion solid polymer electrodes (batteries) |
SPF | South Pacific Forum |
SPI | Schedule Performance Index (EVA term) |
SPN | Solectron part number |
SPQL | Shipped product quality level |
SPRS | Single-pass reflow soldering |
SQACAR | Supplier quality assurance corrective action request |
SQC | Statistical quality control |
SQE | Supplier quality engineer |
SQL | Structured query language |
SQM | Solectron quality manual |
SQP | Statistical quality process |
SQT | Structured query tool |
SRAM | Static random access memory |
SS | Start-To-Start (type of task relationship in Microsoft Project) |
SSD | Solid solder deposition |
SSG | Systems and services group |
SSI | Small-scale integration (up to 100 transistors) |
SSOP | Shrink small outline package |
SSR | Standard setup report or Station shift report |
SST | Silicon Storage Technology |
STARS | Shopfloor tracking and reporting system |
STB | Still To Build |
STC | Solectron technical center |
STQEA | Solectron Total Quality Excellence Award |
STU | Single tray unit (on Q.P. Fuji machines) |
SV | Schedule Variance (EVA term) |
SVGA | Super video graphics adapter |
SVS | Synthetic vision system (used for defect detection) |
SWOT | Strengths, Weaknesses, Opportunities, Threats |
SWP | Standard work procedure |
T | Temperature |
TAB | Tape automated bonding |
TAM | Total available market or Telephone answering machine |
TBC | To be checked or To be confirmed |
TBD | To be defined or To be determined |
TBF | Twin bulb feeder (on FCM Philips machines) or To be fired |
TBGA | Tape ball grid array or Thermal ball grid array. |
TBH | To be hired |
TBR | To be replaced |
TBU | To be updated |
Tbulk | Twin bulk (on FCM Philips machines) |
TC | Transport controller (FCM Philips machines) |
TCC | Temperature coefficient of capacitance |
TCE | Thermal coefficient of expansion or Trichloroethane |
TCN | Temporary change notice or Telefono cordless numerico |
TCO | Total cost of ownership or Temporary change order |
TCP | Tape carrier package (is another name for TAB) or Transmission control protocol |
TCP / IP | Transmission control protocol / Internet protocol |
TCR | Temperature coefficient of resistance |
TCS | Total customer satisfaction |
TCU | Temperature Control Unit |
TDMA | Time division multiplies access |
TDO | Table of denial orders |
TDR | Time demand reflect (days of material in hub, goal = 10) |
TE | Test Engineer |
TEU | Toolbit exchange unit |
TF | Total Float |
TGA | Thermogravimetric analyzer |
TGIF | Thank God is Friday |
TGR | Things Gone Right |
TGW | Things Gone Wrong |
TH | Tooling hole |
THD | Third harmonic distortion |
THT | Through-hole technology |
TIB | Temporary import in bond (Trade agreement) |
TIG | Technology implementation group |
TIM | Test, inspection and measurement |
TLO | Terminal learning objective (on FCM Philips machines) or Total loss only |
TOS | Type of Service |
TOYOTA | Too Often Yankees Overprice This Auto |
TPE | Transfer Project Engineer |
TPI | Test process instruction |
TPM | Technical project manager |
TPM | Technical Production Meeting |
TPR | Technique de Plastic Roumaine |
TPS | Toyota Production System |
TPT | Total process time |
TPU | Tape pack unit (on Fuji machines) |
TQ | Tel quel = tale quale = just as the goods |
TQC | Total quality control |
TQFP | Thin quad flat pack |
TQM | Total quality management |
TRR | Trial run request |
TRRPL | Trial run request in production line |
TRS | Turbo Reflow Solder |
TSB | Target share of business (with suppliers) |
TSBU | Technology solutions business unit |
TSCPA | Tennessee Society of Certified Public Accountants |
TSCR | Temporary Sagem change request |
TSOP | Thin small outline package |
TSSOP | Thin shrink small outline package |
TTL | Transistor-to-transistor logic |
TTL | Time To Live |
TU | Touch up |
TUV | Technisher uberwachungs verein |
TWG | Technology working group |
UC | Unit cost |
UCL | Upper control limit |
UDEAC | Central African Customs and Economic Union |
UDMA | Ultra direct memory access |
UES | User Earth Station |
UFPT | Ultra fine pitch technology |
UL | Underwriters Laboratory |
ULSI | Ultra large-scale integration (exceeds 1 million transistors) |
UMC | Unit manufacturing cost |
UN | United Nations |
UPS | Uninterruptible Power Supply or United Parcel Service (transport company) |
URL | Uniform Resource Locator |
USA | United States of America |
USI | Unscheduled issues |
USL | Upper specification limit |
USR | U.S. Robotics |
UUT | Unit under test |
V | Volt |
VAC | Variance at Completion |
VAR | Value added reseller |
VAT | Value added tax |
VBA | Visual basic for applications |
VBE | Visual Basic editor |
VCD | Various center distance |
VDE | German / European safety standards |
VDR | Verify defect repair |
VDU | Video Display Unit |
VE/VA | Value Engineering/Value Analysis |
VER | Solectron assigned unique 2 digit version code |
VG | Verteidigungasgerte Norm |
VGA | Video graphics adapter |
VH1 | Video hits 1 |
VI | Visual inspection |
VIAFA | Visual inspection after Final assembly |
VIAM | Visual inspection after milling |
VIAMI | Visual inspection after Manual insertion |
VIAR | Visual inspection after reflow |
VIBR | Visual inspection before reflow |
VIFIR | Dell field returns |
VLRR | Verified Line Reject Rate (Dell line fallout returns) |
VLSI | Very large-scale integrated circuits (up to 1 million transistors) or Very large scale integration |
VMI | Vendor managed inventory |
VMS | Volatile methyl-siloxanes |
VOC | Volatile organic compound |
vol | Volume |
VOLVO | Very Odd-Looking Vehicular Object |
VPS | Vapor phase soldering |
VR | Voltage regulator |
VRAM | Video random access memory |
VRM | Voltage regulator module (controls voltage into processor)* |
VSPA | Very small peripheral array |
VTU | View & Touch up. |
VUE | Virtual University Enterprises |
VW | Virtually Worthless |
W | Watt |
W / B | Way bill |
W / O | Work order |
W / W | Warehouse warrant |
WA | With average |
WAC | Weighted average cost |
WAN | Wide area network |
WAP | Wireless Application Protocol |
WB | Waybill |
WBR | Weekly business review |
WBR | With Best Regards |
WBS | Work breakdown structure |
WC | Work cell or Water closet |
WEU | Western European Union |
WG | Weight guaranteed |
WH | Warehouse |
WHO | World Health Organization |
WI | Wettability index |
WIIFM | What’s in it for me (PPS Pro manual – for Philips machines) |
WIP | Work in progress |
WMD | Weller multi digital |
WORD | Word size of a given computer (8 bits or 18 bits, or 32 bits etc.) |
WPA | With particular average |
WPM | Wide placement module (FCM Philips machines) |
WRAM | Windows random access memory |
WTC | World Trade Center |
WVM | Wide vision module (FCM Philips machines) |
WW | World wide |
WWMS | Worldwide materials system |
WWW | World wide web |
WYSIWYG | What you see is what you get |
X’fer | Transfer |
XPI | Customer electronic design data for CADDIE |
Y2K | The year 2000 |
ZFT | Zero-failure throughput |
ZIF | Zero insertion force (connector) |
ZIP | Zig-zag in-line package (socket) |
We like sharing ideas and discussing smart ways to solve problems.
Nick —
Regardless of how the rest of your day goes, here’s something to be happy about — today a honey pot you installed successfully identified a previously unknown email harvester (IP: 218.18.149.113). The harvester was caught by your honey pot installed at:www.nicks-software.com
You can find information about your newly identified harvester here:
https://www.projecthoneypot.org/ip_218.18.149.113
Info on all the harvesters that have been spotted by your honey pots is also available here:
https://www.projecthoneypot.org/list_of_ips.php?t=h&m=usr_hp.h.96565
Don’t forget to tell your friends you made the Internet a little better today. You can refer them to Project Honey Pot directly from our website:
https://www.projecthoneypot.org/refer_a_friend.php
You’ve chosen to receive this message every time one of your honey pots or donated MXs helps identify a new harvester. We don’t blame you, we’re constantly checking in to see what we’ve caught. However, if you’re sick of these messages, you can turn them off by visiting your settings page:
https://www.projecthoneypot.org/preferences.php
Thanks from the entire Project Honey Pot team and, we’re sure if they knew, from the Internet community as a whole.
____________________________________
To block all future requests:
https://www.projecthoneypot.org/block_all_future_contact.phpThis message sent by:
Project Honey Pot (https://www.projecthoneypot.org/)
c/o Unspam Technologies, Inc. (https://www.unspam.com/)
P.O. Box 57265
Murray, Utah 84157-0265 USA
We’ll start sharing info on Nick’s Software Facebook Page:
https://www.facebook.com/pages/Nicks-Software/204617686224074
Please LIKE.
Got this new gorgeous phone Sony Xperia Z1 and it looks and feels amazing.
It has premium looks and premium hardware spec.
Sony advertise the phone as:
Then why my phone looks like a 3 years old, scratched phone after 2 weeks of light use?
The truth is Sony use scratch resistant glass, which is tough and good quality, but this glass is covered with ASF – Anti Shatter Film – which is absolutely low quality and catches scratches just rubbing your nails on it.
So, what can be done?
Looks like the only sensible thing to do is to change the AFS layer by yourself, coz telcos and Sony give you BS only.
Maybe once they get more similar complains they will treat the problem differently.
Removing the ASF you will loose the Sony logo, which is baked into this screen protector rather than etched onto the glass.
And also voids the warranty, they say….which is harsh and unfair having in mind that their ASF layer is faulty and low quality.
If your Xperia Z1 is not scratched yet you should hurry and buy a screen protector that probably is better and will last longer than the original ASF layer.
If your phone is scratched already, here are some good tips on how to remove the ASF without creating more damage to your phone.
https://www.youtube.com/watch?v=Pzxq-90NUIY&feature=player_detailpage
Hope it helps to keep your Xperia Z1 scratch free, as it should be.
As you can see Amazon was kicked out from Top 10. Would be interesting to see why?
Social Media
So, why did Alexa kicked out Amazon from Top 10?
Twitter is better at Social Media Chapter, I guess, not Google+ though:
Backlinks are telling quite the same story Twitter wins by far!
One parameter from here…is very much liked by Google (and Alexa) and can swap the position of these sites at any time in the Top, with minimum variation.
Which one will be?
Your Answers below….
Well, dummy words have no search or competition on the WEB. Let’s write NickSoftware reversed erawtfoskcin and see how quick Google index it and how this mini article will rank in SERP.
My guess, in two minutes, it will be ranking page 1 in SERP for keyword erawtfoskcin.
OK, let’s count.
Got number one in SERP in two days.
Cheers,
Nick’s Software
ERAWTFOSKCIN